公开(公告)号：US20090273357A1

公开(公告)日：2009-11-05

申请号：US12417861

申请日：2009-04-03

申请人： Shoji Kamata ,  Tomoya Sato ,  Toshinaga Takeya ,  Takayuki Hayashizaki

发明人： Shoji Kamata ,  Tomoya Sato ,  Toshinaga Takeya ,  Takayuki Hayashizaki

IPC分类号： G01R31/02 ,  B32B38/00

CPC分类号： G01R1/06727 ,  G01R1/06755 ,  G01R1/07342 ,  G01R3/00

摘要： A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.

摘要翻译： 用于电测试的触点包括要接合到板的第一区域，从第一区域的下端部沿左右方向延伸的第二区域，从第二区域的顶端部分向下突出的第三区域 并且具有比第一区域低的光反射率的低光反射膜。 第三区域具有与电子设备的电极接触的探针尖端。 低光反射膜形成在至少与第一区域的接合部分到板的表面及其接近。

公开(公告)号：US09015934B2

公开(公告)日：2015-04-28

申请号：US13182252

申请日：2011-07-13

申请人： Toshinaga Takeya

发明人： Toshinaga Takeya

IPC分类号： H05K3/30 ,  H05K3/00 ,  G01R31/00 ,  G01R1/073 ,  G01R3/00

CPC分类号： G01R1/07357 ,  G01R3/00 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165

摘要： A method for manufacturing a probe card prepares a plurality of probes, each having a metal layer on an attaching portion, and hot-melt material covering the metal layer. Each probe is attached to a probe substrate by inserting its attaching portion into a different through hole of the probe substrate so that at least a part of the metal layer is located in the through hole. The hot-melt material of each attaching portion is melted and thereafter solidified such that the hot-melt material contacts the metal layer and a part of a wall surface of the through hole, to fix each probe to the probe substrate.

摘要翻译： 用于制造探针卡的方法准备多个在附着部分上具有金属层的探针和覆盖金属层的热熔材料。 将每个探针通过将其附接部分插入到探针基板的不同通孔中而附接到探针基板，使得金属层的至少一部分位于通孔中。 将各粘接部分的热熔材料熔化，然后固化，使得热熔材料与金属层和通孔壁面的一部分接触，将每个探针固定在探针基板上。

公开(公告)号：US09015935B2

公开(公告)日：2015-04-28

申请号：US13182254

申请日：2011-07-13

申请人： Toshinaga Takeya

发明人： Toshinaga Takeya

IPC分类号： H05K3/30 ,  H05K3/00 ,  G01R31/00 ,  G01R3/00

CPC分类号： G01R3/00 ,  G01R1/06738 ,  G01R1/07357 ,  G01R1/07371 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.

摘要翻译： 一种探针卡的制造方法，其特征在于，将各探针的安装部插入到至少排列设置在探针基板上的第一贯通孔之中，将各探针的探针末端部插入分别设置在多个 板状定位构件至少在其厚度方向上至少排成一列，使相邻的定位构件沿相反方向相对移位，以二维地定位探针的探针末端部分，然后软化导电接合材料以将附接部分 的各个探针抵靠第一通孔。

公开(公告)号：US20120042509A1

公开(公告)日：2012-02-23

申请号：US13182254

申请日：2011-07-13

申请人： Toshinaga TAKEYA

发明人： Toshinaga TAKEYA

IPC分类号： H05K3/00

CPC分类号： G01R3/00 ,  G01R1/06738 ,  G01R1/07357 ,  G01R1/07371 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.

摘要翻译： 一种探针卡的制造方法，其特征在于，将各探针的安装部插入到至少排列设置在探针基板上的第一贯通孔之中，将各探针的探针末端部插入分别设置在多个 板状定位构件至少在其厚度方向上至少排成一列，使相邻的定位构件沿相反方向相对移位，以二维地定位探针的探针末端部分，然后软化导电接合材料以将附接部分 的各个探针抵靠第一通孔。

公开(公告)号：US08063651B2

公开(公告)日：2011-11-22

申请号：US12417861

申请日：2009-04-03

申请人： Shoji Kamata ,  Tomoya Sato ,  Toshinaga Takeya ,  Takayuki Hayashizaki

发明人： Shoji Kamata ,  Tomoya Sato ,  Toshinaga Takeya ,  Takayuki Hayashizaki

IPC分类号： G01R31/20

CPC分类号： G01R1/06727 ,  G01R1/06755 ,  G01R1/07342 ,  G01R3/00

摘要： A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.

摘要翻译： 用于电测试的触点包括要接合到板的第一区域，从第一区域的下端部沿左右方向延伸的第二区域，从第二区域的顶端部分向下突出的第三区域 并且具有比第一区域低的光反射率的低光反射膜。 第三区域具有与电子设备的电极接触的探针尖端。 低光反射膜形成在至少与第一区域的接合部分到板的表面及其接近。

公开(公告)号：US20120042516A1

公开(公告)日：2012-02-23

申请号：US13182252

申请日：2011-07-13

申请人： Toshinaga TAKEYA

发明人： Toshinaga TAKEYA

IPC分类号： H01K3/10

CPC分类号： G01R1/07357 ,  G01R3/00 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165

摘要： A method for manufacturing a probe card uses a probe having first and second metal layers made of a material in which wettability of a conductive jointing material to the metal layers is higher than wettability of the jointing material to an attaching portion on an outer circumferential surface of an upper area of the attaching portion and at two opposed surface areas of an area continuing downward from the upper area of the attaching portion, respectively, and having a jointing material layer at the upper area and the two surface areas to cover the first and second metal layers. Each probe is attached to a probe substrate at the attaching portion by melting and thereafter solidifying a material for the jointing material layer in a state where the attaching portion is inserted in a through hole of the probe substrate.

摘要翻译： 探针卡的制造方法使用具有第一金属层和第二金属层的探针，所述第一和第二金属层由导电性接合材料对金属层的润湿性高于接合材料对外周面的附着部的润湿性的材料 所述安装部分的上部区域和从所述安装部分的上部区域继续向下延伸的区域的两个相对的表面区域，并且在所述上部区域和所述两个表面区域处具有覆盖所述第一和第二表面的接合材料层 金属层。 每个探针通过熔化在附着部分附接到探针基底，然后在附着部插入探针基板的通孔的状态下固化用于接合材料层的材料。