公开(公告)号：US12105119B2

公开(公告)日：2024-10-01

申请号：US17440401

申请日：2019-09-06

Applicant: KABUSHI KAISHA NIHON MICRONICS

Inventor： Tomoaki Kuga

IPC: G01R1/073 ,  H01R12/55 ,  H01R13/15 ,  H01R13/24

CPC classification number: G01R1/07357 ,  H01R12/55 ,  H01R13/15 ,  H01R13/2407

Abstract: In order to improve conductivity, the number of components is decreased, and a sliding property of an elastic member can be improved. Elastic force can be controlled in accordance with a characteristic of a contact object, and electrical contact stability with the contact object can be improved.
An electrical contactor of the present disclosure is formed by winding a plate member having conductivity. The electrical contactor includes a first contact part that is formed by winding a first tip part of the plate member, a first elastic part that is formed by winding an upper arm part having a tapered shape, a second contact part that is formed by winding a second tip part, a second elastic part that is formed by winding a lower arm part having a tapered shape, and a cylindrical part that is formed by winding a main body part that is a plate member.

公开(公告)号：US12032002B2

公开(公告)日：2024-07-09

申请号：US17677847

申请日：2022-02-22

Applicant: Intel Corporation

Inventor： Pooya Tadayon

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/0675 ,  G01R1/06716 ,  G01R1/07314 ,  G01R1/07357 ,  G01R31/2889

Abstract: An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear.

公开(公告)号：US11933817B2

公开(公告)日：2024-03-19

申请号：US17574694

申请日：2022-01-13

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Wen-Tsung Lee ,  Hsun-Tai Wei ,  Pang-Chi Huang ,  Meng-Chieh Cheng

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/07357

Abstract: A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.

公开(公告)号：US20240027522A1

公开(公告)日：2024-01-25

申请号：US18354771

申请日：2023-07-19

Applicant: ADVANTEST CORPORATION

Inventor： Takayuki TANAKA ,  Tasuku FUJIBE

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2887 ,  G01R31/2893 ,  G01R31/2889 ,  G01R1/07328 ,  G01R1/07357

Abstract: An interface device is provided between a test head and a DUT. The interface device includes pin electronics ICs, RAM, a pin controller, and nonvolatile memory. The RAM stores data based on a device signal received from the DUT by means of the multiple pin electronics ICs. The pin controller controls the multiple pin electronics ICs according to a control signal from the test head. The multiple pin electronics ICs, the RAM, and the pin controller are mounted on a pin electronics PCB.

公开(公告)号：US20240012028A1

公开(公告)日：2024-01-11

申请号：US18253444

申请日：2021-11-26

Applicant: TECHNOPROBE S.P.A.

Inventor： Flavio MAGGIONI

IPC: G01R1/073 ,  G01R3/00

CPC classification number: G01R1/07314 ,  G01R3/00 ,  G01R1/07357

Abstract: A method of manufacturing a probe card for functionality testing of devices under test (DUT) is disclosed having the steps of providing an interface board configured for interfacing the probe card to a testing apparatus, providing a stiffener, connecting an interposer in the shape of a monobloc of material to the stiffener, cutting the monobloc according to a predetermined pattern after connecting it to the stiffener, thereby defining a plurality of modules which are independent and separated from each other, associating the interface board with the stiffener, and associating a probe head with the interposer. The probe head includes a plurality of contact elements adapted to electrically connect the interposer to contact pads of the devices under test. A probe card obtained by the method is also disclosed.

公开(公告)号：US20230194570A1

公开(公告)日：2023-06-22

申请号：US17728986

申请日：2022-04-26

Applicant: STAR TECHNOLOGIES (WUHAN) CO., LTD.

Inventor： CHOON LEONG LOU

IPC: G01R1/073

CPC classification number: G01R1/07357 ,  G01R1/07314

Abstract: A probe testing device having an elastic structure is provided. The probe testing device having the elastic structure includes a plurality of probe elements and a guide plate module. Each of the probe elements includes a body, a first contact segment, and a second segment, and is formed integrally. The guide plate module includes a first guide plate, a second guide plate, and a third guide plate that are parallel to each other, and the third guide plate is arranged between the first guide plate and the second guide plate. The plurality of probe elements correspondingly pass through the first guide plate, the second guide plate, and the third guide plate. The third guide plate is configured to perform a parallel movement relative to the first guide plate and the second guide plate in a direction perpendicular to an axis of the probe element.

公开(公告)号：US11656247B2

公开(公告)日：2023-05-23

申请号：US16473378

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Ronald Michael Kirby ,  Erkan Acar ,  Joe Walczyk ,  Youngseok Oh ,  Justin M Huttula ,  Mohanraj Prabhugoud

IPC: G01R1/07 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/07357 ,  G01R1/0466

Abstract: A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.

公开(公告)号：US20180299490A1

公开(公告)日：2018-10-18

申请号：US15706996

申请日：2017-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yu-Kyum KIM ,  Gyu-Yeol KIM ,  Jae-Won KIM

IPC: G01R1/073 ,  H04N1/32 ,  H04N1/00 ,  G01R1/067

CPC classification number: G01R1/07357 ,  G01R1/06705 ,  G01R1/07314 ,  G01R1/07342 ,  H04N1/00342 ,  H04N1/32138

Abstract: A probe includes a beam and at least two tips. The beam transmits test signals to a device under test (DUT). The at least two tips are arranged on a first end portion of the beam in a direction at a predetermined angle to a length direction of the beam and contacts adjacent terminals of the DUT. The beam has a larger width that exceeds a sum of widths of the at least two tips in a width direction of the beam such that the probe has an improved current carrying capacity and is prevented from being damaged due to overcurrent.

公开(公告)号：US20180024166A1

公开(公告)日：2018-01-25

申请号：US15718430

申请日：2017-09-28

Applicant: TECHNOPROBE S.p.A.

Inventor： Daniele Acconcia ,  Raffaele Vallauri

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07378 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/06772 ,  G01R1/07314 ,  G01R1/07357

Abstract: It is described a contact probe for a testing head for a testing apparatus of electronic devices, the probe comprising a probe body extended in a longitudinal direction between respective end portions adapted to contact respective contact pads, the second end being a contact tip adapted to abut onto a contact pad of the device under test, the body of each contact probe having a length of less than 5000 μm, and including at least one pass-through opening extending along its longitudinal dimension. Conveniently, the at least one pass-through opening is filled by a filling material, in order to define at least one first and one second lateral portions in the body, being parallel and joined to each other by a connecting central portion realized by the filling material at the pass-through opening, the connecting central portion made of the filling material acting as a strengthening element.

公开(公告)号：US09863978B2

公开(公告)日：2018-01-09

申请号：US14786770

申请日：2014-03-25

Applicant: FEINMETALL GMBH

Inventor： Gunther Böhm ,  Georg Steidle ,  Wolfgang Schäfer ,  Achim Weiland

IPC: G01R1/073 ,  G01R31/28 ,  H01R12/71 ,  H01R12/91

CPC classification number: G01R1/07357 ,  G01R31/2889 ,  H01R12/714 ,  H01R12/91

Abstract: An electrical contacting device for electrical physical contact with a specimen, particularly wafers, taking place in a contacting direction, with at least one conductor substrate which can be electrically connected to a testing device, at least one contact distance transformer and at least one contact head having electrical contact elements, particularly resilient contact elements, preferably serving to compensate different physical contact distances existing in the contacting direction particularly at the contact elements.