公开(公告)号：US06557250B2

公开(公告)日：2003-05-06

申请号：US10003296

申请日：2001-12-06

申请人： Rudi W Opitz ,  Walter P Stuckmann

发明人： Rudi W Opitz ,  Walter P Stuckmann

IPC分类号： H05K336

CPC分类号： H01F17/0013 ,  H01F27/2804 ,  H01F41/041 ,  H05K1/165 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2203/0759 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths, which are provided on at least one side of the mother board, and recesses, which are defined laterally by the circuit paths and towards the mother board by the mother board; and at least one preimpregnated board, which is disposed between the printed boards for joining the printed boards; wherein the recesses, which are disposed between the mother boards of the respective printed boards, are filled substantially entirely with a synthetic resin paste; and wherein the at least two printed boards and the at least one preimpregnated board are joined by pressing.

摘要翻译： 多层印刷板化合物包括至少两个平面重叠的印刷电路板，每个印刷电路板具有电绝缘母板，设置在母板的至少一侧上的导电电路路径，以及凹槽，其横向由 电路通路和母板朝母板; 以及至少一个预浸渍板，其设置在用于接合印刷板的印刷板之间; 其中设置在各个印刷电路板的母板之间的凹部基本上用合成树脂浆料填充; 并且其中所述至少两个印刷板和所述至少一个预浸渍板通过压制而接合。