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公开(公告)号:US08618446B2
公开(公告)日:2013-12-31
申请号:US13173471
申请日:2011-06-30
申请人: Yu Chang , Gwo-Chuan Tzu , Anqing Cui , William W. Kuang , Olkan Cuvalci
发明人: Yu Chang , Gwo-Chuan Tzu , Anqing Cui , William W. Kuang , Olkan Cuvalci
CPC分类号: F27B17/0025 , H01J37/32091 , H01J37/32715 , H01L21/67103 , H01L21/67248
摘要: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a substrate support surface and a shaft; an RF electrode disposed in the substrate support proximate the substrate support surface to receive RF current from an RF source; a heater disposed proximate the substrate support surface to provide heat to a substrate when disposed on the substrate support surface, the heater having one or more conductive lines to provide power to the heater; a thermocouple to measure the temperature of a substrate when disposed on the substrate support surface; and a conductive element having an interior volume with the one or more conductive lines and the thermocouple disposed through the interior volume, the conductive element coupled to the RF electrode and having an electric field of about zero in the interior volume when RF current is flowed through the conductive element.
摘要翻译: 本文提供了用于处理基板的装置。 在一些实施例中,衬底支撑件包括衬底支撑表面和轴; 设置在所述衬底支撑件中的RF电极,靠近所述衬底支撑表面以从RF源接收RF电流; 设置在所述基板支撑表面附近的加热器,以在设置在所述基板支撑表面上时向所述基板提供热量,所述加热器具有一个或多个导线以向所述加热器提供电力; 当设置在基板支撑表面上时测量基板的温度的热电偶; 以及具有内部体积的导电元件,所述一个或多个导电线和所述热电偶设置穿过所述内部体积,所述导电元件耦合到所述RF电极,并且当RF电流流过所述内部体积时具有约零的电场 导电元件。
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公开(公告)号:US20130001215A1
公开(公告)日:2013-01-03
申请号:US13173471
申请日:2011-06-30
申请人: YU CHANG , GWO-CHUAN TZU , ANQING CUI , WILLIAM W. KUANG , OLKAN CUVALCI
发明人: YU CHANG , GWO-CHUAN TZU , ANQING CUI , WILLIAM W. KUANG , OLKAN CUVALCI
IPC分类号: F27D11/02
CPC分类号: F27B17/0025 , H01J37/32091 , H01J37/32715 , H01L21/67103 , H01L21/67248
摘要: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a substrate support surface and a shaft; an RF electrode disposed in the substrate support proximate the substrate support surface to receive RF current from an RF source; a heater disposed proximate the substrate support surface to provide heat to a substrate when disposed on the substrate support surface, the heater having one or more conductive lines to provide power to the heater; a thermocouple to measure the temperature of a substrate when disposed on the substrate support surface; and a conductive element having an interior volume with the one or more conductive lines and the thermocouple disposed through the interior volume, the conductive element coupled to the RF electrode and having an electric field of about zero in the interior volume when RF current is flowed through the conductive element.
摘要翻译: 本文提供了用于处理基板的装置。 在一些实施例中,衬底支撑件包括衬底支撑表面和轴; 设置在所述衬底支撑件中的RF电极,靠近所述衬底支撑表面以从RF源接收RF电流; 设置在所述基板支撑表面附近的加热器,以在设置在所述基板支撑表面上时向所述基板提供热量,所述加热器具有一个或多个导线以向所述加热器提供电力; 当设置在基板支撑表面上时测量基板的温度的热电偶; 以及具有内部体积的导电元件,所述一个或多个导电线和所述热电偶设置穿过所述内部体积,所述导电元件耦合到所述RF电极,并且当RF电流流过所述内部体积时具有约零的电场 导电元件。
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