SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130154114A1

    公开(公告)日:2013-06-20

    申请号:US13327896

    申请日:2011-12-16

    IPC分类号: H01L23/538 G06F17/50

    摘要: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.

    摘要翻译: 半导体电路图案包括具有线部分的倾斜导电图案和在线部分的在线部分的第一侧上垂直于线部分延伸的线部分的端部处的焊盘部分。 垫部分的宽度大于线部分的宽度。 间隔具有邻近焊盘部分的第一侧的第一部分,以及邻近焊盘部分与第一侧相对的第二侧的第二部分。 间隔的第一部分的宽度大于间隔的第二部分的宽度。

    Semiconductor device and method for making same
    2.
    发明授权
    Semiconductor device and method for making same 有权
    半导体装置及其制造方法

    公开(公告)号:US08736072B2

    公开(公告)日:2014-05-27

    申请号:US13327896

    申请日:2011-12-16

    IPC分类号: H01L29/72

    摘要: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.

    摘要翻译: 半导体电路图案包括具有线部分的倾斜导电图案和在线部分的在线部分的第一侧上垂直于线部分延伸的线部分的端部处的焊盘部分。 垫部分的宽度大于线部分的宽度。 间隔具有邻近焊盘部分的第一侧的第一部分,以及邻近焊盘部分与第一侧相对的第二侧的第二部分。 间隔的第一部分的宽度大于间隔的第二部分的宽度。