公开(公告)号：US20190284444A1

公开(公告)日：2019-09-19

申请号：US16463914

申请日：2016-11-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Liang Chen

IPC: C09J7/38 ,  C09J7/20

Abstract: The present disclosure relates to an adhesive composition for forming an adhesive film and an adhesive film obtained therefrom. In the present disclosure, the adhesive composition comprises the following components: (A) a silicone gum having a functional group, which is capable of being cured by heat in the present of a curing agent; (B) a thermoplastic polymer; (C) a curing agent; and (D) a solvent; wherein a weight ratio of the silicone gum to the thermoplastic polymer is in a range of 0.3:10 to 5:10. The adhesive composition is able to form an adhesive film with excellent adhesion strength at not only room temperature but also at a high temperature.

公开(公告)号：US20190040954A1

公开(公告)日：2019-02-07

申请号：US16074784

申请日：2017-01-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Wei Wei ,  Liang Chen ,  Jing Fang ,  Jeffrey W. McCutcheon

IPC: F16J15/06 ,  G11B33/14

Abstract: The present disclosure provides a compressible gasket, an electronic product comprising the compressible gasket and a method for preparing the compressible gasket. The compressible gasket of the present disclosure comprises an open-cell foam matrix and a filling medium which fills and is cured in the open cells of the open-cell foam, the filling medium comprising a curable adhesive and one or more types of micrometer particles dispersed therein. The one or more types of micrometer particles comprise at least one of thermally conductive micrometer particles and thermally and electrically conductive micrometer particles, and optionally comprise at least one of flame retardant micrometer particles, electrically conductive micrometer particles and electromagnetic wave absorption micrometer particles. The compressible gasket of the present invention can provide shock and vibration absorption and sealing functions and also meet requirements on system thermal management design and/or electromagnetic compatibility design.