公开(公告)号：US11879078B2

公开(公告)日：2024-01-23

申请号：US17281104

申请日：2019-10-03

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Adrian T. Jung ,  Boris Tasch ,  Dirk Hasenberg ,  Olaf Ludewig ,  Elisabeth Cura

IPC: C09J5/06 ,  C08G59/50 ,  C08G65/20 ,  C08G65/333 ,  C08K5/00 ,  C09J9/00

CPC classification number: C09J5/06 ,  C08G59/50 ,  C08G65/20 ,  C08G65/33317 ,  C08K5/0025 ,  C09J9/00

Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.