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公开(公告)号:US11803385B2
公开(公告)日:2023-10-31
申请号:US17548105
申请日:2021-12-10
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Sateesh Lagudu , Arun Vaidyanathan Ananthanarayan , Michael Mantor , Allen H. Rush
CPC classification number: G06F9/321 , G06F9/3004 , G06F9/30087 , G06F9/30098 , G06F9/30145 , G06F9/3887 , G06F15/80 , G06T1/20
Abstract: An array processor includes processor element arrays (PEAs) distributed in rows and columns. The PEAs are configured to perform operations on parameter values. A first sequencer received a first direct memory access (DMA) instruction that includes a request to read data from at least one address in memory. A texture address (TA) engine requests the data from the memory based on the at least one address and a texture data (TD) engine provides the data to the PEAs. The PEAs provide first synchronization signals to the TD engine to indicate availability of registers for receiving the data. The TD engine provides second synchronization signals to the first sequencer in response to receiving acknowledgments that the PEAs have consumed the data.
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公开(公告)号:US11200060B1
公开(公告)日:2021-12-14
申请号:US17132002
申请日:2020-12-23
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Sateesh Lagudu , Arun Vaidyanathan Ananthanarayan , Michael Mantor , Allen H. Rush
Abstract: An array processor includes processor element arrays (PEAs) distributed in rows and columns. The PEAs are configured to perform operations on parameter values. A first sequencer received a first direct memory access (DMA) instruction that includes a request to read data from at least one address in memory. A texture address (TA) engine requests the data from the memory based on the at least one address and a texture data (TD) engine provides the data to the PEAs. The PEAs provide first synchronization signals to the TD engine to indicate availability of registers for receiving the data. The TD engine provides second synchronization signals to the first sequencer in response to receiving acknowledgments that the PEAs have consumed the data.
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公开(公告)号:US11409840B2
公开(公告)日:2022-08-09
申请号:US17032314
申请日:2020-09-25
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Sateesh Lagudu , Allen H. Rush , Michael Mantor , Arun Vaidyanathan Ananthanarayan , Prasad Nagabhushanamgari
Abstract: An array processor includes processor element arrays distributed in rows and columns. The processor element arrays perform operations on parameter values. The array processor also includes memory interfaces that are dynamically mapped to mutually exclusive subsets of the rows and columns of the processor element arrays based on dimensions of matrices that provide the parameter values to the processor element arrays. In some cases, the processor element arrays are vector arithmetic logic unit (ALU) processors and the memory interfaces are direct memory access (DMA) engines. The rows of the processor element arrays in the subsets are mutually exclusive to the rows in the other subsets and the columns of the processor element arrays in the subsets are mutually exclusive to the columns in the other subsets. The matrices can be symmetric or asymmetric, e.g., one of the matrices can be a vector having a single column.
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公开(公告)号:US20230289191A1
公开(公告)日:2023-09-14
申请号:US18128642
申请日:2023-03-30
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Sateesh LAGUDU , Allen H. Rush , Michael Mantor , Arun Vaidyanathan Ananthanarayan , Prasad Nagabhushanamgari , Maxim V. Kazakov
CPC classification number: G06F9/3887 , G06F13/28 , G06F13/4027
Abstract: An array processor includes processor element arrays distributed in rows and columns. The processor element arrays perform operations on parameter values. The array processor also includes memory interfaces that broadcast sets of the parameter values to mutually exclusive subsets of the rows and columns of the processor element arrays. In some cases, the array processor includes single-instruction-multiple-data (SIMD) units including subsets of the processor element arrays in corresponding rows, workgroup processors (WGPs) including subsets of the SIMD units, and a memory fabric configured to interconnect with an external memory that stores the parameter values. The memory interfaces broadcast the parameter values to the SIMD units that include the processor element arrays in rows associated with the memory interfaces and columns of processor element arrays that are implemented across the SIMD units in the WGPs. The memory interfaces access the parameter values from the external memory via the memory fabric.
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公开(公告)号:US11635967B2
公开(公告)日:2023-04-25
申请号:US17032307
申请日:2020-09-25
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Sateesh Lagudu , Allen H. Rush , Michael Mantor , Arun Vaidyanathan Ananthanarayan , Prasad Nagabhushanamgari , Maxim V. Kazakov
Abstract: An array processor includes processor element arrays distributed in rows and columns. The processor element arrays perform operations on parameter values. The array processor also includes memory interfaces that broadcast sets of the parameter values to mutually exclusive subsets of the rows and columns of the processor element arrays. In some cases, the array processor includes single-instruction-multiple-data (SIMD) units including subsets of the processor element arrays in corresponding rows, workgroup processors (WGPs) including subsets of the SIMD units, and a memory fabric configured to interconnect with an external memory that stores the parameter values. The memory interfaces broadcast the parameter values to the SIMD units that include the processor element arrays in rows associated with the memory interfaces and columns of processor element arrays that are implemented across the SIMD units in the WGPs. The memory interfaces access the parameter values from the external memory via the memory fabric.
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