公开(公告)号：US20230207527A1

公开(公告)日：2023-06-29

申请号：US17564137

申请日：2021-12-28

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： Wonjun JUNG ,  Jasmeet SINGH NARANG ,  Tyrone HUANG ,  Christopher KLEMENT ,  Alan D. SMITH ,  Edward CHANG ,  John WUU

IPC: H01L25/065 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/481 ,  H01L25/0652 ,  H01L2225/06544

Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.