公开(公告)号：US20140254109A1

公开(公告)日：2014-09-11

申请号：US13787438

申请日：2013-03-06

Applicant: ALLIANT TECHSYSTEMS INC.

Inventor： James D. Lucas ,  Christopher A. McKellips

IPC: H05K1/14

CPC classification number: H05K1/148 ,  F42C15/40 ,  F42C19/02 ,  F42C19/06 ,  H05K1/144 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/053 ,  H05K2201/2036

Abstract: An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.

Abstract translation: 一种电子封装，包括多个相互平行的垂直间隔的电路板，其大致为圆形，并通过柔性电路电连接，该柔性电路包括围绕电路板周向延伸的导体，并具有延伸到每个电路板的分支。 还公开了电子封装前体结构和从前体结构配置电子封装的方法。

公开(公告)号：US08971048B2

公开(公告)日：2015-03-03

申请号：US13787438

申请日：2013-03-06

Applicant: Alliant Techsystems Inc.

Inventor： James D. Lucas ,  Christopher A. McKellips

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K1/148 ,  F42C15/40 ,  F42C19/02 ,  F42C19/06 ,  H05K1/144 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/053 ,  H05K2201/2036

Abstract: An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.

Abstract translation: 一种电子封装，包括多个相互平行的垂直间隔的电路板，其大致为圆形，并通过柔性电路电连接，该柔性电路包括围绕电路板周向延伸的导体，并具有延伸到每个电路板的分支。 还公开了电子封装前体结构和从前体结构配置电子封装的方法。