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1.
公开(公告)号:US12133332B2
公开(公告)日:2024-10-29
申请号:US17537295
申请日:2021-11-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junwhon Uhm , Jungkeun Lee , Hyunmo Yang , Seungnyun Kim , Yongsang Yun
Abstract: An electronic device according to an embodiment includes: a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame, a first printed circuit board (PCB) positioned in the first temple, and a flexible printed circuit board electrically connected to the first PCB, and the flexible printed circuit board includes a first rigid portion connected to the first PCB, a first flexible portion extending from the first rigid portion in a first direction, and a second flexible portion extending from the first rigid portion in a second direction different from the first direction, the second flexible portion being bent in a first bending area to overlap at least a portion of the first flexible portion.
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公开(公告)号:US12120821B2
公开(公告)日:2024-10-15
申请号:US17920960
申请日:2021-04-26
Applicant: Ennovi Industries, Inc.
Inventor: Richard Schneider , Richard A. Johannes
CPC classification number: H05K1/148 , H01R12/52 , H01R12/62 , H01R12/91 , H05K1/147 , H05K3/363 , H05K2201/10598 , H05K2203/167
Abstract: A jumper assembly for connecting together first and second circuit boards. The jumper assembly includes a frame secured to a flexible circuit having a plurality of conductive traces. The frame includes a bridge that connects together first and second side structures, each having a window and a moveable lever. The first side structure is secured over the first circuit board and the second side structure is secured over the second circuit board. First end portions of the traces of the flexible circuit are secured to contact pads of the first circuit board, while second end portions of the traces of the flexible circuit are secured to contact pads of the second circuit board. The bridge of the frame is removed after the jumper assembly is secured to the first and second circuit boards.
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公开(公告)号:US20240276644A1
公开(公告)日:2024-08-15
申请号:US18212502
申请日:2023-06-21
Applicant: Elka International Ltd.
Inventor: YI-CHIEH CHENG
CPC classification number: H05K1/148 , H01R12/53 , H05K1/117 , H01R13/65912 , H05K1/0215 , H05K2201/09227
Abstract: A transmission cable includes a transmission cable, a first circuit board having a first power layout area, a first ground layout area, and a first circuit trace, and a second circuit board having a second power layout area, a second ground layout area, and a second circuit trace. The transmission cable includes a power wire, a pair of signal wires, and a drain wire. When the first power layout area, the first circuit trace, the second power layout area, and the second circuit trace are connected via a resistor, respectively, the drain wire connected between the first circuit trace and the second circuit trace will act as another power wire. Thus, a voltage drop at both ends of the transmission cable can be reduced by increasing the power wires to improve signal transmission quality.
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公开(公告)号:US12041406B2
公开(公告)日:2024-07-16
申请号:US17605821
申请日:2020-04-17
Applicant: Huawei Technologies Co., Ltd.
Inventor: Qingqiu Liu , Baoxia Li , Lin Lu , Guofei Diao
CPC classification number: H04R1/1025 , H02J7/0029 , H02J7/0042 , H04R1/1016 , H04R1/1041 , H04R1/1058 , H05K1/148 , H04R2420/07 , H05K2201/1025
Abstract: A wireless headset includes a housing and a power system disposed in a cavity enclosed by the housing and configured to supply power to the wireless headset. The wireless headset further includes a first electrical connector and a second electrical connector disposed on the housing of the wireless headset and are respectively electrically connected to two electrodes of the power system. The housing includes a rod body and an earbud connected to a top of the rod body, wherein the first electrical connector is located at a bottom end of the rod body, and the second electrical connector is located on an outer side wall of the earbud.
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公开(公告)号:US20240237214A1
公开(公告)日:2024-07-11
申请号:US18401880
申请日:2024-01-02
Applicant: CARUX TECHNOLOGY PTE. LTD.
Inventor: You-Ren LIOU
CPC classification number: H05K1/148 , H05K1/142 , H05K5/0069 , H05K5/0221 , H05K5/0247
Abstract: An electronic device is provided, including a main structure, a fixed member, a first circuit board, and a second circuit board. The main structure includes a first fixing position and a second fixing positing, and the fixed member is affixed to the first fixing position and the second fixing position. The first circuit board and the second circuit board are disposed on the main structure, and they overlap each other. The fixed member is disposed between the first circuit board and the second circuit board.
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6.
公开(公告)号:US20240237212A9
公开(公告)日:2024-07-11
申请号:US18491356
申请日:2023-10-20
Applicant: VEGA Grieshaber KG
Inventor: Thomas ILG , Marius ISENMANN
IPC: H05K1/14
CPC classification number: H05K1/144 , H05K1/148 , H05K2201/042 , H05K2201/048 , H05K2201/10098
Abstract: A field device for process automation in industrial or private environments, comprising an electronic circuit for controlling the field device, wherein the electronic circuit includes a first, a second and a third circuit board. The first circuit board is connected to and attached to the second circuit board and/or to the third circuit board by way of an electrical connector, wherein the second circuit board is located above the third circuit board.
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公开(公告)号:US12031847B2
公开(公告)日:2024-07-09
申请号:US18307274
申请日:2023-04-26
Applicant: SEIKO EPSON CORPORATION
Inventor: Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/166 , H01R12/72 , H05K1/148 , G01D11/30 , H05K2201/09163
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号:US20240187289A1
公开(公告)日:2024-06-06
申请号:US18552568
申请日:2022-03-15
Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
Inventor: Makoto MASHITA , Akira MIYAJO , Masakatsu MORIGUCHI , Takeshi HAGIHARA , Hirofumi URAYAMA
CPC classification number: H04L25/20 , H05K1/148 , H01R4/34 , H01R12/722
Abstract: A communicator (relay) receives a differential signal that is a voltage difference between two electrical signals that propagate through two respective conducting wires. The communicator removes noise from the two electrical signals using a first conductor as a reference potential. The communicator converts the differential signal that is the voltage difference between the two electrical signals with the noise removed into a voltage signal that is a voltage with the reference potential corresponding to a potential of a second conductor. The first conductor and the second conductor are respectively disposed on a first substrate and a second substrate. The first substrate and the second substrate are connected via a substrate connector with flexibility.
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9.
公开(公告)号:US20240138067A1
公开(公告)日:2024-04-25
申请号:US18491356
申请日:2023-10-19
Applicant: VEGA Grieshaber KG
Inventor: Thomas ILG , Marius ISENMANN
IPC: H05K1/14
CPC classification number: H05K1/144 , H05K1/148 , H05K2201/042 , H05K2201/048 , H05K2201/10098
Abstract: A field device for process automation in industrial or private environments, comprising an electronic circuit for controlling the field device, wherein the electronic circuit includes a first, a second and a third circuit board. The first circuit board is connected to and attached to the second circuit board and/or to the third circuit board by way of an electrical connector, wherein the second circuit board is located above the third circuit board.
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公开(公告)号:US20240107672A1
公开(公告)日:2024-03-28
申请号:US18257405
申请日:2021-12-08
Applicant: VALEO VISION
Inventor: Sebastian KRICK
IPC: H05K1/14 , F21S41/153 , F21V23/00 , H05K1/02 , H05K1/18
CPC classification number: H05K1/148 , F21S41/153 , F21V23/005 , H05K1/0204 , H05K1/181 , H05K2201/042 , H05K2201/09972 , H05K2201/10106
Abstract: A light source support assembly for an automotive vehicle, the light source support assembly includes at least two rigid Printed Circuit Board (PCB) parts having a first rigid PCB part and a second rigid PCB part. The first rigid PCB part is mounted with a plurality of first components that are heat generating components and the second rigid PCB part is mounted with a plurality of second components that are components not generating heat or components generating less heat compared to the plurality of first components. A flexible connecting part interconnecting the first rigid PCB part and the second rigid PCB part, and includes at least one bendable portion configured to bend the light source support assembly.
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