公开(公告)号：US20180155024A1

公开(公告)日：2018-06-07

申请号：US15822619

申请日：2017-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wu Seong LEE ,  Tae Kyun KIM ,  Bae Seok LIM ,  Youn Hyung CHOI ,  Seung Nyun KIM ,  Yong Sang YUN

IPC: B64C39/02 ,  B64D47/08 ,  B64D27/24

CPC classification number: B64C39/024 ,  B64C2201/024 ,  B64C2201/027 ,  B64C2201/042 ,  B64C2201/108 ,  B64C2201/127 ,  B64C2201/146 ,  B64C2201/165 ,  B64D27/24 ,  B64D47/08 ,  B64D2221/00 ,  H05K1/148 ,  H05K1/181 ,  H05K2201/047 ,  H05K2201/10151

Abstract: Disclosed are a body of an unmanned aerial vehicle and an unmanned aerial vehicle including the same. The body includes a housing arranged in a first direction and including at least four housing sidewalls and an opening defined by the housing sidewalls and configured to receive a battery pack, a propeller support extending a specific distance from each housing sidewall in a second direction away from the center of the housing and perpendicular to the first direction and having, on a distal end, a motor and a propeller connected to the motor, and a PCB disposed on at least one of the housing sidewalls and associated with operating the motor and the propeller.

公开(公告)号：US09635764B2

公开(公告)日：2017-04-25

申请号：US14866648

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Shipeng Qiu ,  Shawna Liff ,  Kayleen L Helms ,  Joshua D Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K1/14 ,  H05K3/36 ,  H05K3/22 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/22 ,  H05K3/303 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0308 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/057 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2203/10 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194

Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

公开(公告)号：US20170094799A1

公开(公告)日：2017-03-30

申请号：US14866648

申请日：2015-09-25

Applicant: Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

Inventor： Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/22 ,  H05K3/30 ,  H05K1/02 ,  H05K3/36

CPC classification number: H05K1/189 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/22 ,  H05K3/303 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0308 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/057 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2203/10 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194

Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

公开(公告)号：US20170091491A1

公开(公告)日：2017-03-30

申请号：US14865551

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG

IPC: G06F21/87 ,  H05K1/02 ,  H05K3/10 ,  G06F21/72

CPC classification number: H05K3/10 ,  G06F21/72 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/167 ,  H05K3/062 ,  H05K3/366 ,  H05K2201/0352 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

公开(公告)号：US09516757B2

公开(公告)日：2016-12-06

申请号：US14688443

申请日：2015-04-16

Applicant: DELTA ELECTRONICS (Chen Zhou) CO., LTD.

Inventor： Wangjun He ,  Jung-jui Wang ,  Shaofeng Yu

IPC: H05K1/14 ,  H05K1/18 ,  H04Q1/00 ,  H05K3/36

CPC classification number: H05K1/181 ,  H04Q1/00 ,  H05K1/14 ,  H05K3/366 ,  H05K2201/047 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10757 ,  Y10T29/49119

Abstract: An electric connector, a plug-in module thereof and a production method of the plug-in module are provided. The plug-in module comprises a base, an input unit, an output unit and an output end. The base comprises a top plate, a bottom plate and one connection plate. A plurality of input terminals and a plurality of intermediate terminals are fixed to the base. The input unit comprises one input circuit board provided vertically to the base and electrically coupled to an end portion of the input terminals. At least one channel are provided on the input circuit board. Each channel comprises a transformer electrically coupled to the input circuit board. The output unit comprises an output circuit board horizontally provided to the base and electrically coupled to the input circuit board via the intermediate terminals. The output end are fixed to and electrically coupled to the output circuit board.

Abstract translation: 提供电连接器，插件模块和插件模块的制造方法。 插件模块包括基座，输入单元，输出单元和输出端。 基座包括顶板，底板和一个连接板。 多个输入端子和多个中间端子固定到基座。 输入单元包括垂直于基座设置并电耦合到输入端的端部的一个输入电路板。 在输入电路板上至少提供一个通道。 每个通道包括电耦合到输入电路板的变压器。 该输出单元包括一个输出电路板，该输出电路板水平地设置在基座上，并通过中间端子电连接到输入电路板。 输出端固定到电耦合到输出电路板。

公开(公告)号：US09328873B2

公开(公告)日：2016-05-03

申请号：US14221463

申请日：2014-03-21

Applicant: Tai-Hsiang Huang ,  Kuan-Hsiang Huang

Inventor： Tai-Hsiang Huang ,  Kuan-Hsiang Huang

IPC: F21K99/00 ,  H05K1/00 ,  F21Y101/02 ,  F21Y111/00

CPC classification number: F21K9/135 ,  F21K9/232 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/00 ,  H05K3/366 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/10113

Abstract: A light bulb includes a glass bulb having a top part and a bottom part which is connected to the top part. A light unit is located in a space defined between the top and bottom parts. The light unit has a transverse circuit board and at least one upright circuit board. Multiple Light Emitting Diodes are connected to the top surface and the bottom surface of the transverse circuit board. The at least one upright circuit board is connected to the top surface of the transverse circuit board. Multiple Light Emitting Diodes are connected to the outside surface of the at least one upright circuit board. The light beams from the Light Emitting Diodes go through the glass bulb and toward different directions.

Abstract translation: 灯泡包括具有顶部和与顶部连接的底部的玻璃泡。 灯单元位于在顶部和底部之间限定的空间中。 光单元具有横向电路板和至少一个直立电路板。 多个发光二极管连接到横向电路板的顶表面和底表面。 至少一个直立电路板连接到横向电路板的顶表面。 多个发光二极管连接到至少一个直立电路板的外表面。 发光二极管的光束通过玻璃灯泡朝向不同的方向。

公开(公告)号：US20150271921A1

公开(公告)日：2015-09-24

申请号：US14217621

申请日：2014-03-18

Applicant: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY ARMAMENTS BUREAU, M.N.D.

Inventor： SHAO-CHUNG HU ,  KUO-YANG HORNG ,  LING-YUEH YANG ,  WEI-CHING LIU ,  PEN-SHAN CHAO ,  KUN-FENG CHEN ,  LOUIS LU-CHEN HSU

IPC: H05K1/14 ,  H05K3/36 ,  H05K1/02 ,  H05K3/32 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/141 ,  H05K1/148 ,  H05K1/181 ,  H05K3/32 ,  H05K3/366 ,  H05K2201/04 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/10515 ,  Y02P70/611 ,  Y10T29/49126

Abstract: A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.

Abstract translation: 介绍了一种微电子3D封装结构及其制造方法。 微电子3D封装结构包括具有多个第一边缘并且布置有第一电子器件的第一板; 具有多个第二边缘并且设置有第二电子设备的第二板，其中所述第二板的至少一个第二边缘连接到所述第一板的至少一个第一边缘以形成接合线; 以及设置在两个相邻板的接合线处并且适于用作传输信号的连接路径的接合连接部分。

公开(公告)号：US20140334084A1

公开(公告)日：2014-11-13

申请号：US13888724

申请日：2013-05-07

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Jean-Philippe Fricker

IPC: H05K7/14

CPC classification number: H05K1/14 ,  G06F1/181 ,  G06F1/183 ,  G06F1/184 ,  H05K1/144 ,  H05K3/4691 ,  H05K5/0021 ,  H05K7/1417 ,  H05K7/1487 ,  H05K7/1489 ,  H05K2201/047 ,  H05K2201/2072

Abstract: A server system includes an array of server cells. Some or all of the server cells include a set of at least three side panels forming an enclosure and a compute component comprising a processor core. At least one side panel of each server cell is removably mechanically coupled and removably electrically coupled to a facing side panel of an adjacent server cell. The enclosure may form a triangular prism enclosure, a cuboid enclosure, a hexagonal prism enclosure, etc. The enclosure can be formed from a rigid flex printed circuit board (PCB) assembly, whereby the side panels are implemented as rigid PCB sections that are interconnected via flexible PCB sections, with the flexible PCB sections forming corners between the rigid PCB sections when the rigid-flex PCB assembly is folded into the enclosure shape. The compute component and other circuit components are disposed at the interior surfaces of the rigid PCB sections.

Abstract translation: 服务器系统包括服务器单元阵列。 部分或全部服务器单元包括一组至少三个形成外壳的侧面板和包括处理器核心的计算部件。 每个服务器单元的至少一个侧面板可移除地机械耦合并可移除地电耦合到相邻服务器单元的面对侧面板。 外壳可以形成三角形棱镜外壳，长方体外壳，六边形棱镜外壳等。外壳可以由刚性柔性印刷电路板（PCB）组件形成，由此侧面板被实现为互连的刚性PCB部分 通过柔性PCB部分，当刚性PCB组件折叠成外壳形状时，柔性PCB部分在刚性PCB部件之间形成拐角。 计算部件和其他电路部件设置在刚性PCB部分的内表面处。

公开(公告)号：US20140321126A1

公开(公告)日：2014-10-30

申请号：US14357687

申请日：2012-11-20

Applicant: 3M INNOVATION PROPERTIES COMPANY

Inventor： Alejandro Aldrin II Agcaoili Narag ,  Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Justine A. Mooney

IPC: F21V21/14 ,  F21V29/00 ,  F21K99/00

CPC classification number: F21V21/14 ,  F21K9/00 ,  F21K9/232 ,  F21V3/00 ,  F21V29/70 ,  F21W2107/00 ,  F21W2121/00 ,  F21Y2101/00 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/10106 ,  H01L2924/00

Abstract: Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semiconductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.

Abstract translation: 提供了一种包括柔性电路的制品，其包括具有第一和第二主表面的聚合物电介质层，第一和第二主表面中的一个或两个在其上具有导电层，其中至少一个导电层包括电路， 或更多个位于柔性电路上的发光半导体器件，其中柔性电路成形为形成三维结构。

公开(公告)号：US20130058057A1

公开(公告)日：2013-03-07

申请号：US13596762

申请日：2012-08-28

Applicant: Shunjiro TAKEMORI ,  Shigeru NARAKINO

Inventor： Shunjiro TAKEMORI ,  Shigeru NARAKINO

IPC: H05K1/00

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K1/0213 ,  H05K1/141 ,  H05K1/147 ,  H05K5/0208 ,  H05K2201/0314 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2203/178

Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.