公开(公告)号：US12115602B2

公开(公告)日：2024-10-15

申请号：US17309818

申请日：2019-12-26

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit Pandher ,  Niveditha Nagarajan ,  Anil Kumar ,  Morgana de Avila Ribas ,  Gyan Dutt ,  Siuli Sarkar ,  Carl Bilgrien

IPC: B23K35/00 ,  B23K35/26 ,  C22C13/00

CPC classification number: B23K35/262 ,  C22C13/00

Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

公开(公告)号：US12246376B2

公开(公告)日：2025-03-11

申请号：US17594978

申请日：2020-05-05

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Matthew James Siebenhuhner ,  Monnir Boureghda ,  Mike Marczi ,  Carl Bilgrien

IPC: B23K1/00 ,  B22C9/22 ,  B22D21/00 ,  B22D21/06 ,  B22D25/04 ,  B23K101/40

Abstract: A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.