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公开(公告)号：US11162007B2
公开(公告)日：2021-11-02
申请号：US16289789
申请日：2019-03-01
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US20190255662A1
公开(公告)日：2019-08-22
申请号：US16404959
申请日：2019-05-07
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.
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公开(公告)号：US11411150B2
公开(公告)日：2022-08-09
申请号：US16257441
申请日：2019-01-25
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana de Avila Ribas , Pritha Choudhury , Siuli Sarkar , Ranjit Pandher , Nicholas G Herrick , Amit Patel , Ravindra M Bhatkal , Bawa Singh
IPC: B23K35/26 , C22C13/02 , H01L33/62 , H01L23/00 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/08 , H01L33/64
Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
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公开(公告)号：US20190157535A1
公开(公告)日：2019-05-23
申请号：US16257441
申请日：2019-01-25
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana de Avila Ribas , Pritha Choudhury , Siuli Sarkar , Ranjit Pandher , Nicholas G. Herrick , Amit Patel , Ravindra M. Bhatkal , Bawa Singh
Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
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公开(公告)号：US20190262951A1
公开(公告)日：2019-08-29
申请号：US16404909
申请日：2019-05-07
Applicant: ALPHA ASSEMBLY SOLUTIONS, INC.
Inventor： Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.
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Patent Agency Ranking
公开(公告)号：US09802275B2
公开(公告)日：2017-10-31
申请号：US15109352
申请日：2014-12-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana de Avila Ribas , Rahul Raut , Traian Cornel Cucu , Shu Tai Yong , Siuli Sarkar , Ramakrishna Hosur Katagiriyappa
CPC classification number: B23K35/362 , B23K35/025 , B23K35/262 , B23K35/3612 , B23K35/3613 , B23K35/3615 , B23K35/3618 , H05K1/09 , H05K1/111 , H05K9/0024 , H05K2201/032
Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
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公开(公告)号：US12115602B2
公开(公告)日：2024-10-15
申请号：US17309818
申请日：2019-12-26
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Ranjit Pandher , Niveditha Nagarajan , Anil Kumar , Morgana de Avila Ribas , Gyan Dutt , Siuli Sarkar , Carl Bilgrien
CPC classification number: B23K35/262 , C22C13/00
Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.
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公开(公告)号：US20220169905A1
公开(公告)日：2022-06-02
申请号：US17493247
申请日：2021-10-04
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
IPC: C09K5/14 , C01G5/00 , C09C1/62 , C09C3/08 , B82Y30/00 , B22F1/05 , B22F1/16 , B22F1/052 , B22F1/102
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US20190194517A1
公开(公告)日：2019-06-27
申请号：US16289789
申请日：2019-03-01
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
CPC classification number: C09K5/14 , B22F1/0011 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F1/0074 , B22F1/02 , B22F2001/0066 , B82Y30/00 , C01G5/00 , C01P2002/72 , C01P2002/88 , C01P2004/04 , C01P2004/53 , C01P2004/61 , C01P2004/64 , C01P2006/22 , C01P2006/32 , C01P2006/40 , C09C1/62 , C09C3/08 , H01L2924/0002 , H01L2924/00
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US20180102464A1
公开(公告)日：2018-04-12
申请号：US15286759
申请日：2016-10-06
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana de Avila Ribas , Pritha Choudhury , Siuli Sarkar , Ranjit Pandher , Nicholas G. Herrick , Amit Patel , Ravindra M Bhatkal , Bawa Singh
IPC: H01L33/62 , H01L23/00 , H01L33/64 , B23K1/00 , B23K1/08 , B23K1/002 , B23K1/005 , B23K35/26 , C22C13/02
CPC classification number: H01L33/62 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/085 , B23K35/262 , C22C13/02 , H01L24/13 , H01L24/29 , H01L33/641 , H01L33/647 , H01L2224/13211 , H01L2224/13313 , H01L2224/1332 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/29211 , H01L2224/29313 , H01L2224/2932 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2924/01058 , H01L2924/014 , H01L2924/12041 , H01L2924/20106 , H01L2924/351 , H01L2933/0066
Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
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