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公开(公告)号:US10322471B2
公开(公告)日:2019-06-18
申请号:US15326180
申请日:2015-07-15
发明人: Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Ravindra Bhatkal , Bawa Singh
IPC分类号: B23K31/02 , B23K35/26 , B23K35/00 , C22C13/00 , C22C13/02 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/08 , B23K35/02 , H01L23/00 , B23K101/40 , B23K101/42
摘要: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
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公开(公告)号:US20190157535A1
公开(公告)日:2019-05-23
申请号:US16257441
申请日:2019-01-25
发明人: Morgana de Avila Ribas , Pritha Choudhury , Siuli Sarkar , Ranjit Pandher , Nicholas G. Herrick , Amit Patel , Ravindra M. Bhatkal , Bawa Singh
摘要: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
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公开(公告)号:US11411150B2
公开(公告)日:2022-08-09
申请号:US16257441
申请日:2019-01-25
发明人: Morgana de Avila Ribas , Pritha Choudhury , Siuli Sarkar , Ranjit Pandher , Nicholas G Herrick , Amit Patel , Ravindra M Bhatkal , Bawa Singh
IPC分类号: B23K35/26 , C22C13/02 , H01L33/62 , H01L23/00 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/08 , H01L33/64
摘要: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
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公开(公告)号:US20210205935A1
公开(公告)日:2021-07-08
申请号:US17149503
申请日:2021-01-14
发明人: Shamik Ghoshal , Remya Chandran , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Bawa Singh
摘要: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.
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公开(公告)号:US10065274B2
公开(公告)日:2018-09-04
申请号:US14909888
申请日:2014-08-29
发明人: Ranjit Pandher , Bawa Singh , Rahul Raut , Sanyogita Arora , Ravindra Bhatkal , Bin Mo
IPC分类号: B23K35/36 , B23K35/26 , B23K35/362 , B23K35/02 , B23K1/012 , B23K1/08 , B23K1/19 , C22C13/00
摘要: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.
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公开(公告)号:US20170197281A1
公开(公告)日:2017-07-13
申请号:US15326180
申请日:2015-07-15
发明人: Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Ravindra Bhatkal , Bawa Singh
CPC分类号: B23K35/262 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/085 , B23K35/00 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K2101/40 , B23K2101/42 , C22C13/00 , C22C13/02 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29117 , H01L2224/29123 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29149 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29172 , H01L2224/2918 , H01L2224/83815 , H01L2924/01015 , H01L2924/0102 , H01L2924/01032 , H01L2924/01034 , H01L2924/01052 , H01L2924/01058
摘要: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
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公开(公告)号:US11162007B2
公开(公告)日:2021-11-02
申请号:US16289789
申请日:2019-03-01
发明人: Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
摘要: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号:US10682732B2
公开(公告)日:2020-06-16
申请号:US15562195
申请日:2016-03-31
发明人: Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
IPC分类号: C09J163/00 , C08L63/00 , C08K3/00 , C08K3/04 , C08K3/34 , C08K5/54 , C08K9/00 , B23K35/36 , B23K1/00 , B23K35/02 , H01L23/29 , H01L23/00 , C08K5/00 , C08K3/013 , B23K1/20 , C08K7/02 , B23K35/00 , C08K5/549 , B32B27/38 , B23K101/42
摘要: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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公开(公告)号:US20190255662A1
公开(公告)日:2019-08-22
申请号:US16404959
申请日:2019-05-07
发明人: Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
摘要: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.
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公开(公告)号:US20190143461A9
公开(公告)日:2019-05-16
申请号:US15562195
申请日:2016-03-31
发明人: Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
摘要: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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