Improved method of soldering
    1.
    发明授权
    Improved method of soldering 失效
    改进的焊接方法

    公开(公告)号:US3716909A

    公开(公告)日:1973-02-20

    申请号:US3716909D

    申请日:1972-04-13

    CPC classification number: B23K35/268 B23K35/264

    Abstract: An improved soldering alloy for soldered joints comprising one or more aluminum members has a base containing lead and bismuth to which is added a small amount of silver or indium. The solder alloy has a low melting point of typically less than 480*F together with very good corrosion resistance. The alloy can also contain relatively small amounts of tin, zinc and antimony.

    Abstract translation: 一种用于包括一个或多个铝构件的焊接接头的改进的焊接合金具有含有铅和铋的基底,其中加入少量的银或铟。 焊料合金的熔点通常低于480°F,耐腐蚀性也非常好。 该合金还可以含有相对少量的锡,锌和锑。

    Lead-bismuth alloy for soldering aluminum
    2.
    发明授权
    Lead-bismuth alloy for soldering aluminum 失效
    用于焊接铝的铅双相合金

    公开(公告)号:US3769007A

    公开(公告)日:1973-10-30

    申请号:US3769007D

    申请日:1972-04-13

    CPC classification number: C22C11/08 B23K35/268

    Abstract: An improved soldering alloy especially suitable for soldered joints comprising one or more aluminum members has a base containing lead and bismuth to which is added a small amount of silver or indium. The solder alloy has a low melting point of typically less than 480*F together with very good corrosion resistance. The alloy can also contain relatively small amounts of tin, zinc and antimony.

    Abstract translation: 特别适用于包含一个或多个铝构件的焊接接头的改进的焊接合金具有含有铅和铋的基底,其中加入少量的银或铟。 焊料合金的熔点通常低于480°F,耐腐蚀性也非常好。 该合金还可以含有相对少量的锡,锌和锑。

Patent Agency Ranking