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    Protected interconnect for solid state camera module
    1.
    发明授权
    Protected interconnect for solid state camera module 有权

    公开(公告)号：US11150438B2

    公开(公告)日：2021-10-19

    申请号：US16324260

    申请日：2017-08-09

    Applicant: Apple Inc.

    Inventor： Ya Wen Hsu ,  Pierre-Jean Y. Parodi-Keravec ,  Steven Webster

    IPC: G02B7/02 ,  G02B7/09 ,  H04N5/225 ,  G02B7/04

    Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.

    Compact camera module
    2.
    发明授权
    Compact camera module 有权

    公开(公告)号：US10373992B1

    公开(公告)日：2019-08-06

    申请号：US15672249

    申请日：2017-08-08

    Applicant: Apple Inc.

    Inventor： Ya Wen Hsu ,  Douglas S. Brodie ,  Steven Webster

    IPC: H01L27/00 ,  H04N5/00 ,  H01L27/146 ,  H04N5/225 ,  G02B7/02 ,  H01L31/0232

    Abstract: Compact camera modules that may be used in small form factor devices. The camera module may include a lens holder configured to receive one or more lens elements and a photosensor. In some embodiments, the lens holder may define a first recess for receiving the lens elements and a second recess for receiving one or more other components, such as the photosensor. In some embodiments, the photosensor may be configured to communicate with a flex circuit board without coupling the photosensor to a substrate to form a flip chip that communicates with the flex circuit board. The photosensor may be optically aligned with the lens elements and bonded to the lens holder such that the photosensor is fixed in an aligned position and at least partially enclosed by the lens holder.

    PROTECTED INTERCONNECT FOR SOLID STATE CAMERA MODULE
    3.
    发明申请
    PROTECTED INTERCONNECT FOR SOLID STATE CAMERA MODULE 审中-公开

    公开(公告)号：US20190179107A1

    公开(公告)日：2019-06-13

    申请号：US16324260

    申请日：2017-08-09

    Applicant: Apple Inc.

    Inventor： Ya Wen Hsu ,  Pierre-Jean Y. Parodi-Keravec ,  Steven Webster

    IPC: G02B7/09 ,  H04N5/225

    Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.

    Capacitive Sensor Packaging
    4.
    发明申请
    Capacitive Sensor Packaging 审中-公开

    公开(公告)号：US20180276449A1

    公开(公告)日：2018-09-27

    申请号：US15985562

    申请日：2018-05-21

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Shawn Arnold ,  Barry J. Corlett ,  Terry L. Gilton ,  Syed Husaini ,  Steven Webster ,  Scott A. Myers ,  Matthew D. Hill ,  Benjamin B. Lyon

    IPC: G06K9/00 ,  G06F3/044

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    Camera actuator with magnet holder having magnetic field
    9.
    发明授权
    Camera actuator with magnet holder having magnetic field 有权

    公开(公告)号：US12204115B2

    公开(公告)日：2025-01-21

    申请号：US17804787

    申请日：2022-05-31

    Applicant: Apple Inc.

    Inventor： Scott W. Miller ,  Steven Webster ,  Shashank Sharma

    IPC: G02B27/64 ,  G02B7/09 ,  H02K41/035

    Abstract: In some embodiments, a camera includes a lens assembly in a lens carrier, an image sensor for capturing a digital representation of light transiting the lens, and a voice coil motor. In some embodiments, the voice coil motor includes a spring suspension assembly for moveably mounting the lens carrier to an actuator base, a plurality of permanent magnets mounted to the actuator base through a magnet holder assembly and a focusing coil fixedly mounted to the lens carrier and mounted to the actuator base through the suspension assembly. In some embodiments, the permanent magnets each generate a magnetic field of a respective permanent magnet field strength, and the magnet holder assembly generates a holder magnetic field of a holder magnetic field strength.

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