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Patent Agency Ranking
公开(公告)号：US10298820B2
公开(公告)日：2019-05-21
申请号：US15673253
申请日：2017-08-09
Applicant: Apple Inc.
Inventor： Ya Wen Hsu , Douglas S. Brodie , Steven Webster
IPC: H04N5/225 , G02B13/00 , G02B27/64 , G02B7/09 , G03B13/36 , G03B17/14 , H04N3/14 , H04N5/235 , G02B7/08
Abstract: A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.
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公开(公告)号：US20180048796A1
公开(公告)日：2018-02-15
申请号：US15673253
申请日：2017-08-09
Applicant: Apple Inc.
Inventor： Ya Wen Hsu , Douglas S. Brodie , Steven Webster
CPC classification number: H04N5/2254 , G02B7/08 , G02B7/09 , G02B13/001 , G02B27/64 , G02B27/646 , G03B13/36 , G03B17/14 , H04N3/155 , H04N5/2253 , H04N5/235
Abstract: A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.
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公开(公告)号：US11150438B2
公开(公告)日：2021-10-19
申请号：US16324260
申请日：2017-08-09
Applicant: Apple Inc.
Inventor： Ya Wen Hsu , Pierre-Jean Y. Parodi-Keravec , Steven Webster
Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.
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公开(公告)号：US10373992B1
公开(公告)日：2019-08-06
申请号：US15672249
申请日：2017-08-08
Applicant: Apple Inc.
Inventor： Ya Wen Hsu , Douglas S. Brodie , Steven Webster
IPC: H01L27/00 , H04N5/00 , H01L27/146 , H04N5/225 , G02B7/02 , H01L31/0232
Abstract: Compact camera modules that may be used in small form factor devices. The camera module may include a lens holder configured to receive one or more lens elements and a photosensor. In some embodiments, the lens holder may define a first recess for receiving the lens elements and a second recess for receiving one or more other components, such as the photosensor. In some embodiments, the photosensor may be configured to communicate with a flex circuit board without coupling the photosensor to a substrate to form a flip chip that communicates with the flex circuit board. The photosensor may be optically aligned with the lens elements and bonded to the lens holder such that the photosensor is fixed in an aligned position and at least partially enclosed by the lens holder.
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公开(公告)号：US20190179107A1
公开(公告)日：2019-06-13
申请号：US16324260
申请日：2017-08-09
Applicant: Apple Inc.
Inventor： Ya Wen Hsu , Pierre-Jean Y. Parodi-Keravec , Steven Webster
Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.
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