公开(公告)号：US20160133782A1

公开(公告)日：2016-05-12

申请号：US14538769

申请日：2014-11-11

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  KARTHIK ELUMALAI ,  JEN SERN LEW ,  MINGWEI ZHU

IPC: H01L33/00 ,  C23C16/458

CPC classification number: C23C16/4586 ,  C23C16/303 ,  H01L21/6831 ,  H01L21/68771

Abstract: Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.

Abstract translation: 本文提供了改进的衬底载体的实施例。 在一些实施例中，衬底载体包括：多层盘，其具有由连续材料形成的上层和下层以及设置在其间的静电电极结构，其中所述多层盘的尺寸和布置为具有标称尺寸 其超过了用于制造发光二极管器件的标准衬底尺寸的标称尺寸，并且其中所述多层盘围绕中心轴对称地形成并且限定了基本平坦的上表面。

公开(公告)号：US20180144960A1

公开(公告)日：2018-05-24

申请号：US15623503

申请日：2017-06-15

Applicant: APPLIED MATERIALS, INC.

Inventor： JUN-LIANG SU ,  KARTHIK ELUMALAI ,  ENG SHENG PEH ,  Sriskantharajah THIRUNAVUKARASU ,  DIMANTHA RAJAPAKSA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  G01B11/24

Abstract: Systems, apparatuses and methods for determining a surface profile of a substrate are provided. In one embodiment, a method includes projecting a signal having a vertical component/profile across the surface of the substrate from a plurality of locations along a first side of the substrate, capturing the projected signals at each of a plurality of respective locations across the surface of the substrate and determining a surface profile for the substrate using the captured signals. The process can be automated using a controller having predetermined projection and capture positions along respective sides of the substrate, where a surface profile of the substrate can be automatically determined by the controller using the captured signals.

公开(公告)号：US20180112310A1

公开(公告)日：2018-04-26

申请号：US15827845

申请日：2017-11-30

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  KARTHIK ELUMALAI ,  JEN SERN LEW ,  MINGWEI ZHU

IPC: C23C16/458 ,  H01L21/687 ,  H01L21/683 ,  C23C16/30

CPC classification number: C23C16/4586 ,  C23C16/303 ,  H01L21/6831 ,  H01L21/68771

Abstract: Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.