公开(公告)号：US20230298920A1

公开(公告)日：2023-09-21

申请号：US18120752

申请日：2023-03-13

Applicant: ASM IP Holding B.V.

Inventor： Sergei Golovkov ,  Koji Tanaka

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01L21/67288 ,  H01J37/32724 ,  H01J2237/24564 ,  H01J2237/3321

Abstract: Electrostatic chuck assemblies, systems including the assemblies, and methods of using the electrostatic chuck assemblies and systems are disclosed. Exemplary electrostatic chuck assemblies include a detector or circuit to detect a chucking event, such as insufficient chucking power and/or substrate warpage. Exemplary systems and methods can adjust a chucking power based on the measured or determined chucking event.

公开(公告)号：US20250022692A1

公开(公告)日：2025-01-16

申请号：US18764584

申请日：2024-07-05

Applicant: ASM IP Holding B.V.

Inventor： Koji Tanaka

IPC: H01J37/32 ,  H01L21/683

Abstract: An electrostatic chuck device of the present disclosure includes a stage having on its upper surface a circular substrate attached area (where DS is the diameter of the area) to which a circular substrate to be processed is electrostatically attached; and an ESC electrode embedded in the stage, having a diameter DE1 larger than the diameter DS of the substrate attached area, and arranged concentrically with the center of the substrate attached area in plan view; wherein the substrate to be processed is electrostatically attached to the upper surface of the stage by the Johnsen-Rahbek force by applying a DC voltage to the ESC electrode, and the stage includes a high-resistance ring-shaped portion in an outer portion arranged outside the substrate attached area in plan view, which is configured to suppress current leaking from the outer portion to the plasma space when the DC voltage is applied.

公开(公告)号：US20220084786A1

公开(公告)日：2022-03-17

申请号：US17471339

申请日：2021-09-10

Applicant: ASM IP Holding B.V.

Inventor： Sam Kim ,  Koji Tanaka

IPC: H01J37/32

Abstract: A susceptor assembly for a reactor system may provide various plasma control benefits. The susceptor assembly includes a body, a heater element, a first electrode, and a second electrode, according to various embodiments. The body may have a top surface, a side surface, and a bottom surface, wherein the top surface is a substrate support surface. The heater element may be embedded within the body. The first and second electrodes may also be embedded within the body of the susceptor assembly, with the first electrode disposed between the heater element and the top surface of the body. The second electrode may be generally disposed proximate at least one of the side surface and the bottom surface.