公开(公告)号：US20230298920A1

公开(公告)日：2023-09-21

申请号：US18120752

申请日：2023-03-13

Applicant: ASM IP Holding B.V.

Inventor： Sergei Golovkov ,  Koji Tanaka

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01L21/67288 ,  H01J37/32724 ,  H01J2237/24564 ,  H01J2237/3321

Abstract: Electrostatic chuck assemblies, systems including the assemblies, and methods of using the electrostatic chuck assemblies and systems are disclosed. Exemplary electrostatic chuck assemblies include a detector or circuit to detect a chucking event, such as insufficient chucking power and/or substrate warpage. Exemplary systems and methods can adjust a chucking power based on the measured or determined chucking event.

公开(公告)号：US20250132131A1

公开(公告)日：2025-04-24

申请号：US18919874

申请日：2024-10-18

Applicant: ASM IP Holding B.V.

Inventor： Akshay Gunaji ,  Sergei Golovkov ,  ByungWook Son ,  Gopu Krishna ,  DaeYoun Kim

IPC: H01J37/32

Abstract: A plasma modulation apparatus for use in a substrate processing system is disclosed. The apparatus comprising: a plurality of radio frequency (RF) paths connected to N different meshes, wherein a susceptor of the substrate processing system is divided into the N different meshes and N is an integer equal to or greater than 2, wherein each of the RF paths comprises: an RF rod connected to a mesh and configured to transmit RF signal from the meshes; a Voltage-Current (VI) sensor connected to the RF rod and configured to measure a current from the RF rod; and a variable impedance circuit connected to the VI sensor and configured to change an impedance of the RF path and further configured to be grounded, wherein each of the RF paths are grounded separately and each of the RF paths corresponds to a different mesh, respectively.