公开(公告)号：US11685998B2

公开(公告)日：2023-06-27

申请号：US16014320

申请日：2018-06-21

Applicant: ASM IP Holding B.V.

Inventor： Takashi Wada ,  Satoru Noguchi ,  Wataru Adachi ,  Daisuke Muramatsu

IPC: C23C16/52 ,  C23C16/455

CPC classification number: C23C16/52 ,  C23C16/45525

Abstract: Examples of a substrate processing apparatus includes a device for subjecting a substrate to processing, and a controller for modifying a control parameter predetermined to control the device with a first modification value and a second modification value that vary over time, thereby calculating a modified parameter, and controlling the device based on the modified parameter, wherein the first modification value has a shorter term for modifying the control parameter than the second modification value.

公开(公告)号：US10216176B2

公开(公告)日：2019-02-26

申请号：US14264698

申请日：2014-04-29

Applicant: ASM IP Holding B.V.

Inventor： Takashi Wada

IPC: G05B19/418 ,  H01L21/677

Abstract: A substrate processing apparatus includes a plurality of arms used for transferring a substrate, a plurality of processing sections for processing the substrate, a recipe storage section storing at least one recipe for designating at least one of the plurality of arms as a usable arm and at least one of the plurality of processing sections as a usable processing section and for specifying processing conditions in the usable processing section, and a control unit for, according to the at least one recipe, controlling the plurality of arms and the plurality of processing sections so that a substrate is transferred using the usable arm and is processed in the usable processing section under the processing conditions.