公开(公告)号：US11685998B2

公开(公告)日：2023-06-27

申请号：US16014320

申请日：2018-06-21

Applicant: ASM IP Holding B.V.

Inventor： Takashi Wada ,  Satoru Noguchi ,  Wataru Adachi ,  Daisuke Muramatsu

IPC: C23C16/52 ,  C23C16/455

CPC classification number: C23C16/52 ,  C23C16/45525

Abstract: Examples of a substrate processing apparatus includes a device for subjecting a substrate to processing, and a controller for modifying a control parameter predetermined to control the device with a first modification value and a second modification value that vary over time, thereby calculating a modified parameter, and controlling the device based on the modified parameter, wherein the first modification value has a shorter term for modifying the control parameter than the second modification value.