公开(公告)号：US20230401694A1

公开(公告)日：2023-12-14

申请号：US18033786

申请日：2021-11-02

Applicant: ASML NETHERLANDS B.V.

Inventor： Chenxi LIN ,  Yi ZOU ,  Tanbir HASAN ,  Huina XU ,  Ren-Jay KOU ,  Nabeel Noor MOIN ,  Kourosh NAFISI

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: A method and apparatus for identifying locations to be inspected on a substrate is disclosed. A defect location prediction model is trained using a training dataset associated with other substrates to generate a prediction of defect or non-defect and a confidence score associated with the prediction for each of the locations based on process-related data associated with the substrates. Those of the locations determined by the defect location prediction model as having confidences scores satisfying a confidence threshold are added to a set of locations to be inspected by an inspection system. After the set of locations are inspected, the inspection results data is obtained, and the defect location prediction model is incrementally trained by using the inspection results data and process-related data for the set of locations as training data.

公开(公告)号：US20240062356A1

公开(公告)日：2024-02-22

申请号：US18268924

申请日：2021-12-09

Applicant: ASML Netherlands B.V.

Inventor： Huina XU ,  Yana MATSUSHITA ,  Tanbir HASAN ,  Ren-Jay KOU ,  Namita Adrianus GOEL ,  Hongmei LI ,  Maxim PISARENCO ,  Marleen KOOIMAN ,  Chrysostomos BATISTAKIS ,  Johannes ONVLEE

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G06T2207/10061 ,  G06T2207/20021 ,  G06T2207/30148 ,  G06T2207/20081

Abstract: A method and apparatus for analyzing an input electron microscope image of a first area on a first wafer are disclosed. The method comprises obtaining a plurality of mode images from the input electron microscope image corresponding to a plurality of interpretable modes. The method further comprises evaluating the plurality of mode images, and determining, based on evaluation results, contributions from the plurality of interpretable modes to the input electron microscope image. The method also comprises predicting one or more characteristics in the first area on the first wafer based on the determined contributions. In some embodiments, a method and apparatus for performing an automatic root cause analysis based on an input electron microscope image of a wafer are also disclosed.