公开(公告)号：US20230267711A1

公开(公告)日：2023-08-24

申请号：US18015313

申请日：2021-07-29

申请人： ASML NETHERLANDS B.V.

发明人： Scott Anderson MIDDLEBROOKS ,  Maxim PISARENCO ,  Markus Gerardus Martinus Maria VAN KRAAIJ ,  Coen Adrianus VERSCHUREN

IPC分类号： G06V10/774 ,  G06N3/0464 ,  G06V10/50

CPC分类号： G06V10/774 ,  G06N3/0464 ,  G06V10/50

摘要： A method and apparatus for selecting patterns from an image such as a design layout. The method includes obtaining an image (e.g., of a target layout) having a plurality of patterns; determining, based on pixel intensities within the image, a metric (e.g., entropy) indicative of an amount of information contained in one or more portions of the image; and selecting, based on the metric, a sub-set of the plurality of patterns from the one or more portions of the image having values of the metric within a specified range. The sub-set of patterns can be provided as training data for training a model associated with a patterning process.

公开(公告)号：US20220375063A1

公开(公告)日：2022-11-24

申请号：US17761578

申请日：2020-09-14

申请人： ASML Netherlands B.V.

发明人： Maxim PISARENCO ,  Scott Anderson MIDDLEBROOKS ,  Mark John MASLOW ,  Marie-Claire VAN LARE ,  Chrysostomos BATISTAKIS

IPC分类号： G06T7/00 ,  G06V10/77 ,  G06V10/82 ,  G03F7/20

摘要： A system and method for generating predictive images for wafer inspection using machine learning are provided. Some embodiments of the system and method include acquiring the wafer after a photoresist applied to the wafer has been developed; imaging a portion of a segment of the developed wafer; acquiring the wafer after the wafer has been etched; imaging the segment of the etched wafer; training a machine learning model using the imaged portion of the developed wafer and the imaged segment of the etched wafer; and applying the trained machine learning model using the imaged segment of the etched wafer to generate predictive images of a developed wafer. Some embodiments include imaging a segment of the developed wafer; imaging a portion of the segment of the etched wafer; training a machine learning model; and applying the trained machine learning model to generate predictive after-etch images of the developed wafer.

公开(公告)号：US20240020961A1

公开(公告)日：2024-01-18

申请号：US18039483

申请日：2021-12-08

申请人： ASML NETHERLANDS B.V.

发明人： Maxim PISARENCO ,  Chrysostomos BATISTAKIS ,  Scott Anderson MIDDLEBROOKS

IPC分类号： G06V10/82 ,  G06V10/98

CPC分类号： G06V10/82 ,  G06V10/993

摘要： A method for training a machine learning model includes obtaining a set of unpaired after-development (AD) images and after-etch (AE) images associated with a substrate. Each AD image in the set is obtained at a location on the substrate that is different from the location at which any of the AE images is obtained. The method further includes training the machine learning model to generate a predicted AE image based on the AD images and the AE images, wherein the predicted AE image corresponds to a location from which an input AD image of the AD images is obtained.

公开(公告)号：US20230036630A1

公开(公告)日：2023-02-02

申请号：US17963063

申请日：2022-10-10

申请人： ASML Netherlands B.V.

发明人： Coen Adrianus VERSCHUREN ,  Scott Anderson MIDDLEBROOKS ,  Maxim PISARENCO

IPC分类号： G06T7/00

摘要： A method for determining an optimized weighting of an encoder and decoder network; the method comprising: for each of a plurality of test weightings, performing the following steps with the encoder and decoder operating using the test weighting: (a) encoding, using the encoder, a reference image and a distorted image into a latent space to form an encoding; (b) decoding the encoding, using the decoder, to form a distortion map indicative of a difference between the reference image and a distorted image; (c) spatially transforming the distorted image by the distortion map to obtain an aligned image; (d) comparing the aligned image to the reference image to obtain a similarity metric; and (e) determining a loss function which is at least partially defined by the similarity metric; wherein the optimized weighting is determined to be the test weighting which has an optimized loss function.

公开(公告)号：US20220335290A1

公开(公告)日：2022-10-20

申请号：US17639609

申请日：2020-08-12

申请人： ASML NETHERLANDS B.V.

发明人： Maxim PISARENCO ,  Scott Anderson MIDDLEBROOKS ,  Coen Adrianus VERSCHUREN

IPC分类号： G06N3/08 ,  G06N3/04

摘要： A method for increasing certainty in parameterized model predictions. The method includes clustering dimensional data in a latent space associated with a parameterized model into clusters. Different clusters correspond to different portions of a given input. The method includes predicting, with the parameterized model, an output based on the dimensional data in the latent space. The method includes transforming, with the parameterized model, the dimensional data in the latent space into a recovered version of the given input that corresponds to one or more of the clusters. In some embodiments, the method includes determining which one or more clusters correspond to predicted outputs with higher variance, and making the parameterized model more descriptive by adding to the dimensionality of the latent space, and/or training the parameterized model with more diverse training data associated with one or more determined clusters or parts thereof associated with predicted outputs with the higher variance.

公开(公告)号：US20190310554A1

公开(公告)日：2019-10-10

申请号：US16464705

申请日：2017-11-29

申请人： ASML NETHERLANDS B.V.

发明人： Scott Anderson MIDDLEBROOKS ,  Adrianus Cornelis Matheus KOOPMAN ,  Markus Gerardus Martinus Maria VAN KRAAIJ ,  Maxim PISARENCO

IPC分类号： G03F7/20

摘要： A method including: obtaining a logistic mathematical model predicting the formation of a physical structure created using a patterning process; evaluating the logistic mathematical model to predict formation of a part of the physical structure and generate an output; and adapting, based on the output, an aspect of the patterning process.

公开(公告)号：US20190033725A1

公开(公告)日：2019-01-31

申请号：US16042302

申请日：2018-07-23

申请人： ASML Netherlands B.V.

发明人： Nitesh PANDEY ,  Maxim PISARENCO ,  Alessandro POLO

IPC分类号： G03F7/20 ,  G01N21/956 ,  G01N29/06

摘要： A method and apparatus to measure overlay from images of metrology targets, images obtained using acoustic waves, for example images obtained using an acoustic microscope. The images of two targets are obtained, one image using acoustic waves and one image using optical waves, the edges of the images are determined and overlay between the two targets is obtained as the difference between the edges of the two images.

公开(公告)号：US20240233305A1

公开(公告)日：2024-07-11

申请号：US18415596

申请日：2024-01-17

申请人： ASML Netherlands B.V.

发明人： Maxim PISARENCO ,  Scott Anderson MIDDLEBROOKS ,  Markus Gerardus Martinus Maria VAN KRAAIJ ,  Coen Adrianus VERSCHUREN

IPC分类号： G06V10/24 ,  G06T11/00

CPC分类号： G06V10/24 ,  G06T11/00

摘要： Disclosed herein is a non-transitory computer readable medium that has stored therein a computer program, wherein the computer program comprises code that, when executed by a computer system, instructs the computer system to perform a method for generating synthetic distorted images, the method comprising: obtaining an input set that comprises a plurality of distorted images; determining, using a model, distortion modes of the distorted images in the input set; generating a plurality of different combinations of the distortion modes; generating, for each one of the plurality of combinations of the distortion modes, a synthetic distorted image in dependence on the combination; and including each of the synthetic distorted images in an output set.

公开(公告)号：US20240054669A1

公开(公告)日：2024-02-15

申请号：US18266792

申请日：2021-11-24

申请人： ASML NETHERLANDS B.V.

发明人： Tim HOUBEN ,  Thomas Jarik HUISMAN ,  Maxim PISARENCO ,  Scott Anderson MIDDLEBROOKS ,  Chrysostomos BATISTAKIS ,  Yu CAO

IPC分类号： G06T7/593 ,  G06T5/50 ,  G06T7/13

CPC分类号： G06T7/593 ,  G06T5/50 ,  G06T7/13 ,  G06T2207/10061 ,  G06T2207/20084 ,  G06T2207/10012 ,  G06T2207/20212 ,  G06T2207/20081 ,  G06T2207/30148

摘要： A system, method, and apparatus for determining three-dimensional (3D) information of a structure of a patterned substrate. The 3D information can be determined using one or more models configured to generate 3D information (e.g., depth information) using only a single image of a patterned substrate. In a method, the model is trained by obtaining a pair of stereo images of a structure of a patterned substrate. The model generates, using a first image of the pair of stereo images as input, disparity data between the first image and a second image, the disparity data being indicative of depth information associated with the first image. The disparity data is combined with the second image to generate a reconstructed image corresponding to the first image. Further, one or more model parameters are adjusted based on the disparity data, the reconstructed image, and the first image.

公开(公告)号：US20220350254A1

公开(公告)日：2022-11-03

申请号：US17621494

申请日：2020-06-04

申请人： ASML NETHERLANDS B.V.

发明人： Maxim PISARENCO ,  Maurits VAN DER SCHAAR ,  Huaichen ZHANG ,  Marie-Claire VAN LARE

IPC分类号： G03F7/20

摘要： A method for applying a deposition model in a semiconductor manufacturing process. The method includes predicting a deposition profile of a substrate using the deposition model; and using the predicted deposition profile to enhance a metrology target design. The deposition model can be calibrated using experimental cross-section profile information from a layer of a physical substrate. In some embodiments, the deposition model is a machine-learning model, and calibrating the deposition model includes training the machine-learning model. The metrology target design may include an alignment metrology target design or an overlay metrology target design, for example.