公开(公告)号：US20200372201A1

公开(公告)日：2020-11-26

申请号：US16993685

申请日：2020-08-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Frank Gang CHEN ,  Joseph Werner De Vocht ,  Yuelin Du ,  Wanyu Li ,  Yen-Wen Lu

IPC: G06F30/398 ,  G03F7/20

Abstract: A method for determining an overlapping process window (OPW) of an area of interest on a portion of a design layout for a device manufacturing process for imaging the portion onto a substrate, the method including: obtaining a plurality of features in the area of interest; obtaining a plurality of values of one or more processing parameters of the device manufacturing process; determining existence of defects, probability of the existence of defects, or both in imaging the plurality of features by the device manufacturing process under each of the plurality of values; and determining the OPW of the area of interest from the existence of defects, the probability of the existence of defects, or both.

公开(公告)号：US09842186B2

公开(公告)日：2017-12-12

申请号：US14861847

申请日：2015-09-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Frank Gang Chen ,  Joseph Werner De Vocht ,  Yuelin Du ,  Wanyu Li ,  Yen-Wen Lu

IPC: G06F17/50 ,  G03F7/20

CPC classification number: G06F17/5081 ,  G03F7/705 ,  G03F7/70508 ,  G03F7/70625 ,  G03F7/70641 ,  G03F7/70666

Abstract: Disclosed herein is a computer-implemented method for determining an overlapping process window (OPW) of an area of interest on a portion of a design layout for a device manufacturing process for imaging the portion onto a substrate, the method comprising: obtaining a plurality of features in the area of interest; obtaining a plurality of values of one or more processing parameters of the device manufacturing process; determining existence of defects, probability of the existence of defects, or both in imaging the plurality of features by the device manufacturing process under each of the plurality of values; and determining the OPW of the area of interest from the existence of defects, the probability of the existence of defects, or both.

公开(公告)号：US11379648B2

公开(公告)日：2022-07-05

申请号：US16993685

申请日：2020-08-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Frank Gang Chen ,  Joseph Werner De Vocht ,  Yuelin Du ,  Wanyu Li ,  Yen-Wen Lu

IPC: G06F30/398 ,  G03F7/20

Abstract: A method for determining an overlapping process window (OPW) of an area of interest on a portion of a design layout for a device manufacturing process for imaging the portion onto a substrate, the method including: obtaining a plurality of features in the area of interest; obtaining a plurality of values of one or more processing parameters of the device manufacturing process; determining existence of defects, probability of the existence of defects, or both in imaging the plurality of features by the device manufacturing process under each of the plurality of values; and determining the OPW of the area of interest from the existence of defects, the probability of the existence of defects, or both.

公开(公告)号：US10755025B2

公开(公告)日：2020-08-25

申请号：US15821051

申请日：2017-11-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Frank Gang Chen ,  Joseph Werner De Vocht ,  Yuelin Du ,  Wanyu Li ,  Yen-Wen Lu

IPC: G06F30/398 ,  G06F7/20 ,  G03F7/20

Abstract: Disclosed herein is a computer-implemented method for determining an overlapping process window (OPW) of an area of interest on a portion of a design layout for a device manufacturing process for imaging the portion onto a substrate, the method including: obtaining a plurality of features in the area of interest; obtaining a plurality of values of one or more processing parameters of the device manufacturing process; determining existence of defects, probability of the existence of defects, or both in imaging the plurality of features by the device manufacturing process under each of the plurality of values; and determining the OPW of the area of interest from the existence of defects, the probability of the existence of defects, or both.