公开(公告)号：US20210208511A1

公开(公告)日：2021-07-08

申请号：US16468304

申请日：2017-11-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Hans Erik KATTOUW ,  Valerio ALTINI ,  Bearrach MOEST

IPC: G03F7/20 ,  G03F9/00

Abstract: A lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus has a controller configured to define a control grid associated with positioning of a substrate within the lithographic apparatus. The control grid is based on a device layout, associated with a patterning device, defining a device pattern which is to be, and/or has been, applied to the substrate in a lithographic process.

公开(公告)号：US20220057719A1

公开(公告)日：2022-02-24

申请号：US17520803

申请日：2021-11-08

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Hans Erik KATTOUW ,  Valerio ALTINI ,  Bearrach MOEST

IPC: G03F7/20 ,  G03F9/00

Abstract: A lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus has a controller configured to define a control grid associated with positioning of a substrate within the lithographic apparatus. The control grid is based on a device layout, associated with a patterning device, defining a device pattern which is to be, and/or has been, applied to the substrate in a lithographic process.

公开(公告)号：US20240192610A1

公开(公告)日：2024-06-13

申请号：US18437564

申请日：2024-02-09

Applicant: ASML Netherlands B.V.

Inventor： Gijs TEN HAAF ,  Everhardus Cornelis MOS ,  Hans Erik KATTOUW ,  Ralph BRINKHOF

IPC: G03F7/00

CPC classification number: G03F7/705 ,  G03F7/70633

Abstract: Disclosed is a method for determining a process correction for at least a first process of a lithographic process, comprising at least the first process performed on at least a first substrate using at least a first apparatus and a second process performed on at least said first substrate using at least a second apparatus, where a correction actuation capability of the first apparatus differs from the second apparatus, comprising: obtaining metrology data relating to said first substrate; modeling said metrology data using a first model, the model being related to said first apparatus; and controlling said first process based on the modeled metrology data; the modeling step and/or an additional processing step comprises distributing a penalty in a performance parameter across said first process and said second process such that the distributed penalties in the performance parameter are within their respective specifications of the performance parameter.

公开(公告)号：US20220334499A1

公开(公告)日：2022-10-20

申请号：US17639631

申请日：2020-08-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Jacob Fredrik Friso KLINKHAMER ,  Valerio ALTINI ,  Hans Erik KATTOUW ,  Theo Wilhelmus Maria THIJSSEN

IPC: G03F7/20

Abstract: A method for determining a correction for control of a lithographic process for exposing a pattern on an exposure field using a lithographic apparatus. The method including obtaining a spatial profile describing spatial variation of a performance parameter across at least a portion of the exposure field and co-determining control profiles for the spatial profile to minimize error in the performance parameter while ensuring a minimum contrast quality. The co-determined control profiles include at least a stage control profile for control of a stage arrangement of the lithographic apparatus and an optical element (e.g., lens) manipulator control profile for control of an optical element manipulator of the lithographic apparatus, the manipulator operable to perform a correction for at least magnification in a direction perpendicular to the substrate plane.