公开(公告)号：US20230027621A1

公开(公告)日：2023-01-26

申请号：US17960830

申请日：2022-10-06

Applicant: AUO Corporation

Inventor： Tsung-Ying Ke ,  Chun-Nan Chen ,  Zih-Shuo Huang

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

公开(公告)号：US11751329B2

公开(公告)日：2023-09-05

申请号：US17960830

申请日：2022-10-06

Applicant: AUO Corporation

Inventor： Tsung-Ying Ke ,  Chun-Nan Chen ,  Zih-Shuo Huang

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/0283 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/09 ,  H05K1/095 ,  H05K1/111 ,  H05K2201/0314 ,  H05K2201/0338 ,  H05K2201/09263 ,  H05K2201/10106

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.