公开(公告)号：US20240356251A1

公开(公告)日：2024-10-24

申请号：US18455803

申请日：2023-08-25

Applicant: Cisco Technology, Inc.

Inventor： David Nozadze ,  Mike Sapozhnikov ,  Amendra Koul ,  Sayed Ashraf Mamun ,  Upen Reddy Kareti

IPC: H01R12/53 ,  H01R12/55 ,  H05K1/14

CPC classification number: H01R12/53 ,  H01R12/55 ,  H05K1/144 ,  H01R43/007 ,  H05K1/0219 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/10356

Abstract: In some aspects, the techniques described herein relate to an apparatus for connecting cables to Input Output (IO) connector pins, including: a first Printed Circuit Board (PCB) configured to receive terminal ends of a plurality of cables, wherein the terminal ends of the plurality of cables are electrically isolated from one another in the first PCB; a second PCB configured to receive a plurality of IO connector pins, wherein the plurality of IO connector pins are electrically isolated from one another in the second PCB; and wherein the first PCB is configured to join to the second PCB to connect each of the terminal ends of the plurality of cables to corresponding pins of the plurality of IO connector pins.

公开(公告)号：US11751329B2

公开(公告)日：2023-09-05

申请号：US17960830

申请日：2022-10-06

Applicant: AUO Corporation

Inventor： Tsung-Ying Ke ,  Chun-Nan Chen ,  Zih-Shuo Huang

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/0283 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/09 ,  H05K1/095 ,  H05K1/111 ,  H05K2201/0314 ,  H05K2201/0338 ,  H05K2201/09263 ,  H05K2201/10106

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

公开(公告)号：US10074919B1

公开(公告)日：2018-09-11

申请号：US15625149

申请日：2017-06-16

Applicant: INTEL CORPORATION

Inventor： Zhen Zhou ,  Daqiao Du ,  Anne M. Sepic ,  Kai Xiao

IPC: H01R12/00 ,  H01R12/71 ,  H01R12/75 ,  H01R43/20 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/00

CPC classification number: H01R12/714 ,  H01R12/75 ,  H01R43/205 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/4644 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09545 ,  H05K2201/10265 ,  H05K2201/10909 ,  H05K2203/06 ,  H05K2203/162

Abstract: Embodiments of the present disclosure may relate to a printed circuit board (PCB) that includes a first outer layer and a second outer layer opposite the first outer layer. The PCB may further include a routing layer between the first outer layer and the second outer layer, and an interconnect positioned within the first outer layer and coupled with the routing layer. The interconnect may include a contact within an opening in the first outer layer, wherein the contact is within a plane defined by an outer surface of the first outer layer. The interconnect may further include a plated via directly coupled with the contact and the routing layer. Other embodiments may be described or claimed.

公开(公告)号：US09888562B2

公开(公告)日：2018-02-06

申请号：US13726509

申请日：2012-12-24

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/14 ,  H05K9/00 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/36

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

公开(公告)号：US20180033520A1

公开(公告)日：2018-02-01

申请号：US15551431

申请日：2016-02-16

Applicant: National Institute of Advanced Industrial Science and Technology

Inventor： Manabu Yoshida ,  Sei Uemura ,  Taiki Nobeshima

IPC: H01B7/06 ,  H01B13/008

CPC classification number: H01B7/06 ,  H01B7/08 ,  H01B13/00 ,  H01B13/008 ,  H05K1/02 ,  H05K1/0283 ,  H05K1/09 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/0133 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/09263 ,  H05K2203/1545

Abstract: Conductor wires 2a and 2b are sandwiched between two elastomer sheets 1a and 1b whose adhesive layers face each other, and both adhere. When the elastomer sheets 1a and 1b are their natural lengths without being subjected to any tension, the conducting wires 2a and 2b are wound around into spiral shapes and contract. When tension is applied to the elastomer sheets 1a and 1b, the number of spiral turns of the conductor wires 2a and 2b decreases according to its extension and the conductor wires 2a and 2b extend. The conductor wires 2a and 2b are electrically connected to and fixed to a circuit element at both ends of the elastomer sheets 1a and 1b. As a result, it is possible to mass-produce, at low costs, highly stretchable wirings in which a change in resistance values due to extension thereof is small.

公开(公告)号：US09869807B2

公开(公告)日：2018-01-16

申请号：US15070498

申请日：2016-03-15

Applicant: Apple Inc.

Inventor： Hoon Sik Kim ,  Yung-Yu Hsu ,  Paul S. Drzaic

IPC: F21V9/00 ,  F21V8/00 ,  G06F1/16 ,  H01L51/00

CPC classification number: G02B6/0041 ,  G02B6/00 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/006 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G06F1/1643 ,  G06F1/1652 ,  G06F2203/04102 ,  G06F2203/04106 ,  G06F2203/04109 ,  H01L23/5387 ,  H01L51/0097 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/0283 ,  H05K1/0287 ,  H05K1/141 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10378

Abstract: An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.

公开(公告)号：US09832874B2

公开(公告)日：2017-11-28

申请号：US14745526

申请日：2015-06-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas C. Doering ,  Ralph Heller ,  Ronald P. Luijten ,  Martin L. Schmatz

IPC: H05K3/20 ,  H05K1/11 ,  H01R12/73 ,  H05K1/14 ,  H01R43/26 ,  H01R12/52 ,  H01R13/24 ,  H05K3/36

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

公开(公告)号：US20170331208A1

公开(公告)日：2017-11-16

申请号：US15667170

申请日：2017-08-02

Applicant: Hamilton Sundstrand Corporation

Inventor： Robert C. Cooney ,  John A. Dickey ,  Christian Miller ,  Kevin Case Fritz

IPC: H01R12/70 ,  H01R13/52 ,  H05K1/18 ,  H05K3/32 ,  H01R43/20

CPC classification number: H01R12/7076 ,  H01R13/5202 ,  H01R43/205 ,  H05K1/181 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10287

Abstract: A method for fabricating a circuit board apparatus includes providing a circuit board that has a socket with at least one plated through-hole and providing a connector that has a housing with first and second connector interfaces that have, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and interior of the housing to the second connector contact at the second connector interface. The first connector contact is inserted through the resilient seal and into the plated through-hole such that the resilient seal intimately seals around the first connector contact to provide a barrier at the first connector interface into the vapor path.

公开(公告)号：US20170257944A1

公开(公告)日：2017-09-07

申请号：US15505220

申请日：2015-08-28

Applicant: Nokia Technologies Oy

Inventor： Adam ROBINSON ,  Darryl COTTON ,  Piers ANDREW

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/498 ,  H05K3/10

CPC classification number: H05K1/0283 ,  H01L23/4985 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/0314 ,  H05K2201/0394 ,  H05K2201/09263

Abstract: An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.

公开(公告)号：US20170170583A1

公开(公告)日：2017-06-15

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan WEALE ,  Julian Peter MAYES

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/658 ,  H05K1/02 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.