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Patent Agency Ranking
公开(公告)号：USD896217S1
公开(公告)日：2020-09-15
申请号：US29723393
申请日：2020-02-06
Applicant: Advanced Micro Devices, Inc.
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公开(公告)号：USD878359S1
公开(公告)日：2020-03-17
申请号：US29615083
申请日：2017-08-25
Applicant: Advanced Micro Devices, Inc.
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公开(公告)号：US09848515B1
公开(公告)日：2017-12-19
申请号：US15166563
申请日：2016-05-27
Applicant: Advanced Micro Devices, Inc.
Inventor： Christopher Janak , Steve Capezza , Christopher M Jaggers , David A McAfee , Ali Akbar Merrikh , Matthew Grossman , Nicholas Poteracki , Jefferson West , Paul Hughes
CPC classification number: H05K7/20781 , G06F1/20 , G06F2200/201 , H05K7/1488 , H05K7/20736
Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.
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公开(公告)号：US20170347498A1
公开(公告)日：2017-11-30
申请号：US15166563
申请日：2016-05-27
Applicant: Advanced Micro Devices, Inc.
Inventor： Christopher Janak , Steve Capezza , Christopher M. Jaggers , David A. McAfee , Ali Akbar Merrikh , Matthew Grossman , Nicholas Poteracki , Jefferson West , Paul Hughes
CPC classification number: H05K7/20781 , G06F1/20 , G06F2200/201 , H05K7/1488 , H05K7/20736
Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.
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公开(公告)号：USD798904S1
公开(公告)日：2017-10-03
申请号：US29548331
申请日：2015-12-11
Applicant: Advanced Micro Devices, Inc.
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