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Patent Agency Ranking
公开(公告)号：US09958921B2
公开(公告)日：2018-05-01
申请号：US14641510
申请日：2015-03-09
Applicant: Advanced Micro Devices, Inc.
Inventor： Ashish Jain , Benjamin David Bates , Ali Akbar Merrikh , Samuel David Naffziger , Steven Frederick Liepe , Madhu Saravana Sibi Govindan
Abstract: A method includes controlling a power limit of a computing system based on a determined skin temperature of at least one location on an outer surface of a device housing the computing system. A processor includes a processing unit and a power management controller to control a power limit of the processing unit based on a determined skin temperature of at least one location on an outer surface of a device housing the processor.
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公开(公告)号：US20160266629A1
公开(公告)日：2016-09-15
申请号：US14641513
申请日：2015-03-09
Applicant: Advanced Micro Devices, Inc.
Inventor： Ali Akbar Merrikh , Ashish Jain , Benjamin David Bates , Yasuko Eckert , Indrani Paul , Wei Huang , Manish Arora , Alexander Joseph Branover , Sridhar V. Gada , Andrew McNamara , Samuel David Naffziger , Steven Frederick Liepe , Madhu Saravana Sibi Govindan
IPC: G06F1/28
CPC classification number: G06F1/28 , G06F1/206 , G06F1/3206 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/16 , Y02D10/172
Abstract: A method includes adjusting a maximum skin temperature threshold of a device based on a device state, adjusting a power limit for the device based on the adjusted maximum skin temperature threshold, and operating the device based on the adjusted power limit. A processor includes a processing unit and a power management controller to adjust a maximum skin temperature threshold based on a device state and adjust a power limit for the processing unit based on the adjusted maximum skin temperature threshold.
Abstract translation: 一种方法包括基于设备状态来调整设备的最大皮肤温度阈值，基于调整的最大皮肤温度阈值来调整设备的功率限制，以及基于调整的功率限制来操作设备。 处理器包括处理单元和功率管理控制器，用于基于设备状态调整最大皮肤温度阈值，并且基于经调整的最大皮肤温度阈值来调整处理单元的功率限制。
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公开(公告)号：US09848515B1
公开(公告)日：2017-12-19
申请号：US15166563
申请日：2016-05-27
Applicant: Advanced Micro Devices, Inc.
Inventor： Christopher Janak , Steve Capezza , Christopher M Jaggers , David A McAfee , Ali Akbar Merrikh , Matthew Grossman , Nicholas Poteracki , Jefferson West , Paul Hughes
CPC classification number: H05K7/20781 , G06F1/20 , G06F2200/201 , H05K7/1488 , H05K7/20736
Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.
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公开(公告)号：US20170347498A1
公开(公告)日：2017-11-30
申请号：US15166563
申请日：2016-05-27
Applicant: Advanced Micro Devices, Inc.
Inventor： Christopher Janak , Steve Capezza , Christopher M. Jaggers , David A. McAfee , Ali Akbar Merrikh , Matthew Grossman , Nicholas Poteracki , Jefferson West , Paul Hughes
CPC classification number: H05K7/20781 , G06F1/20 , G06F2200/201 , H05K7/1488 , H05K7/20736
Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.
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5.发明申请公开(公告)号：US20160266628A1
公开(公告)日：2016-09-15
申请号：US14641510
申请日：2015-03-09
Applicant: Advanced Micro Devices, Inc.
Inventor： Ashish Jain , Benjamin David Bates , Ali Akbar Merrikh , Samuel David Naffziger , Steven Frederick Liepe , Madhu Saravana Sibi Govindan
Abstract: A method includes controlling a power limit of a computing system based on a determined skin temperature of at least one location on an outer surface of a device housing the computing system. A processor includes a processing unit and a power management controller to control a power limit of the processing unit based on a determined skin temperature of at least one location on an outer surface of a device housing the processor.
Abstract translation: 一种方法包括基于容纳计算系统的设备的外表面上的至少一个位置的确定的皮肤温度来控制计算系统的功率限制。 处理器包括处理单元和功率管理控制器，用于基于容纳处理器的设备的外表面上的至少一个位置的确定的皮肤温度来控制处理单元的功率限制。
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