公开(公告)号：US20240019493A1

公开(公告)日：2024-01-18

申请号：US17866342

申请日：2022-07-15

Applicant: Advanced Micro Devices, Inc.

Inventor： SongGan Zang ,  Qi Shao ,  Lifeng Zhang ,  Ahmet Tokuz ,  Lu Lu

IPC: G01R31/3185 ,  G01R31/28

CPC classification number: G01R31/318583 ,  G01R31/318572 ,  G01R31/2834

Abstract: A system and method for efficiently routing scan data between two dies used in three-dimensional packaging are described. In various implementations, a computing system includes at least a first semiconductor die (or first die) and a second die connected to one another within a three-dimensional (3D) package. The first die and the second die have multiple non-scan input/output (I/O) data channels between them for data transfer. The non-scan I/O data channels are partitioned into groups. The first die receives a given scan input data bit for testing a device under test (DUT) on the second die. The first die selects a first group of non-scan I/O data channels, and sends, to the second die, a copy of the given scan input data bit on each non-scan I/O data channel of the first group. The second die uses a voter circuit to determine the value of the given scan input data bit.