公开(公告)号：US20230187387A1

公开(公告)日：2023-06-15

申请号：US18109787

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  An-Ping CHIEN

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/38 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L23/49838 ,  H01L21/4846 ,  H01Q1/38 ,  H01L23/552 ,  H01L2223/6677

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

公开(公告)号：US20220068665A1

公开(公告)日：2022-03-03

申请号：US17002433

申请日：2020-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  An-Ping CHIEN

IPC: H01L21/50 ,  B23K1/00

Abstract: The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.

公开(公告)号：US20210398921A1

公开(公告)日：2021-12-23

申请号：US16907049

申请日：2020-06-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  An-Ping CHIEN

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01Q1/38

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.