公开(公告)号：US11626525B2

公开(公告)日：2023-04-11

申请号：US17013350

申请日：2020-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun Yu Ko ,  Tsu-Hsiu Wu ,  Meng-Jen Wang

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/02 ,  H01L23/00

Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

公开(公告)号：US11569422B2

公开(公告)日：2023-01-31

申请号：US17016034

申请日：2020-09-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Tang Chu ,  Tsu-Hsiu Wu ,  Chun Yu Ko

IPC: H01L33/60 ,  H01L33/52 ,  H01L31/09

Abstract: A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.