公开(公告)号：US20250096213A1

公开(公告)日：2025-03-20

申请号：US18369108

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Pai-Sheng SHIH ,  Kuan-Fu CHEN ,  Cheng Kai CHANG

IPC: H01L25/16

Abstract: An optical package structure is provided. The optical package structure includes a carrier, an optical emitter, an optical receiver, an optical barrier, and an insulating structure. The optical emitter and the optical receiver are over the carrier. The optical barrier is over the carrier and between the optical emitter and the optical receiver, wherein the optical barrier defines a cavity. The insulating structure is filled in the cavity, wherein an elevation of a top surface of the insulating structure is lower than an elevation of a top surface of the optical barrier with respect to a surface of the carrier.