公开(公告)号：US20250048541A1

公开(公告)日：2025-02-06

申请号：US18923638

申请日：2024-10-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jhen CIOU ,  Jenchun CHEN ,  Chang-Fu LU ,  Pai-Sheng SHIH

IPC: H05K1/02 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

公开(公告)号：US20230269866A1

公开(公告)日：2023-08-24

申请号：US17680069

申请日：2022-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jhen CIOU ,  Jenchun CHEN ,  Chang-Fu LU ,  Pai-Sheng SHIH

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K2201/10098

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

公开(公告)号：US20250096213A1

公开(公告)日：2025-03-20

申请号：US18369108

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Pai-Sheng SHIH ,  Kuan-Fu CHEN ,  Cheng Kai CHANG

IPC: H01L25/16

Abstract: An optical package structure is provided. The optical package structure includes a carrier, an optical emitter, an optical receiver, an optical barrier, and an insulating structure. The optical emitter and the optical receiver are over the carrier. The optical barrier is over the carrier and between the optical emitter and the optical receiver, wherein the optical barrier defines a cavity. The insulating structure is filled in the cavity, wherein an elevation of a top surface of the insulating structure is lower than an elevation of a top surface of the optical barrier with respect to a surface of the carrier.