公开(公告)号：US11791227B2

公开(公告)日：2023-10-17

申请号：US17317770

申请日：2021-05-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuoching Cheng ,  Yuan-Feng Chiang ,  Ya Fang Chan ,  Wen-Long Lu ,  Shih-Yu Wang

IPC: H01L23/31 ,  H01L25/065 ,  H01L21/56 ,  H01L23/538 ,  H01L23/16

CPC classification number: H01L23/31 ,  H01L21/56 ,  H01L23/16 ,  H01L23/5386 ,  H01L25/0655

Abstract: An electronic device package and a method for manufacturing an electronic device package are provided. The electronic device package includes electronic device structure which includes a first electronic device and a first encapsulant, a second electronic device, and a second encapsulant. The first encapsulant encapsulates the first electronic device. The second electronic device is adjacent to the electronic device structure. The second encapsulant encapsulates the electronic device structure and the second electronic device. A first extension line along a lateral surface of the first electronic device and a second extension line along a lateral surface of the first encapsulant define a first angle, the second extension line along the lateral surface of the first encapsulant and a third extension line along a lateral surface of the second electronic device define a second angle, and the first angle is different from the second angle.