公开(公告)号：US20180128612A1

公开(公告)日：2018-05-10

申请号：US15862476

申请日：2018-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Seungbae Park ,  Yu-Ho Hsu ,  Chin-Li Kao ,  Tai-Yuan Huang

IPC: G01C11/04 ,  G01B11/245

CPC classification number: G01C11/04 ,  G01B11/245 ,  G01B2210/56

Abstract: The measurement equipment includes a rack, a first image capturing device, a second image capturing device, a third image capturing device and a fourth image capturing device. Wherein, the first image capturing device and the second image capturing device capture an entire image of a to-be-measured object, the third image capturing device and the fourth image capturing device capture a plurality of local images of a plurality of local areas of the to-be-measured object, and the entire image and the local images and are simultaneously captured.

公开(公告)号：US10344383B2

公开(公告)日：2019-07-09

申请号：US15668632

申请日：2017-08-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chuan-Yung Shih ,  Tai-Yuan Huang ,  Yu-Chi Wang ,  Chin-Feng Wang ,  Sing-Syuan Shiau ,  Chun-Wei Shih ,  Shao-Ci Huang ,  Huang-Hsien Chang ,  Yuan-Feng Chiang

IPC: H01L21/02 ,  C23C16/458 ,  H01L21/285 ,  H01L21/677 ,  H01L21/687

Abstract: In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.

公开(公告)号：US10222209B2

公开(公告)日：2019-03-05

申请号：US15862476

申请日：2018-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Seungbae Park ,  Yu-Ho Hsu ,  Chin-Li Kao ,  Tai-Yuan Huang

IPC: G01C11/02 ,  G01C11/04 ,  G01B11/245

Abstract: The measurement equipment includes a rack, a first image capturing device, a second image capturing device, a third image capturing device and a fourth image capturing device. Wherein, the first image capturing device and the second image capturing device capture an entire image of a to-be-measured object, the third image capturing device and the fourth image capturing device capture a plurality of local images of a plurality of local areas of the to-be-measured object, and the entire image and the local images and are simultaneously captured.

公开(公告)号：US09891048B2

公开(公告)日：2018-02-13

申请号：US14167786

申请日：2014-01-29

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Seungbae Park ,  Yu-Ho Hsu ,  Chin-Li Kao ,  Tai-Yuan Huang

IPC: G01C11/04 ,  G01B11/245

CPC classification number: G01C11/04 ,  G01B11/245 ,  G01B2210/56

Abstract: The measurement equipment includes a rack, a first image capturing device, a second image capturing device, a third image capturing device and a fourth image capturing device. Wherein, the first image capturing device and the second image capturing device capture an entire image of a to-be-measured object, the third image capturing device and the fourth image capturing device capture a plurality of local images of a plurality of local areas of the to-be-measured object, and the entire image and the local images and are simultaneously captured.