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公开(公告)号:US20180290882A1
公开(公告)日:2018-10-11
申请号:US15574349
申请日:2016-06-10
Applicant: Agency for Science, Technology and Research
Inventor: Daniel Minwoo Rhee , Peter Hyun Kee Chang
Abstract: According to various embodiments, there is provided a method for fabricating a semiconductor package, the method including forming a cap structure and a pillar from a first wafer; bonding the first wafer to a second wafer; and filling a gap between the pillar and the cap structure with a mold compound.
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2.
公开(公告)号:US20160111980A1
公开(公告)日:2016-04-21
申请号:US14895838
申请日:2014-06-23
Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Inventor: Chengliang Sun , Xiaojing Mu , Peter Hyun Kee Chang , Qingxin Zhang , Alex Yuandong Gu , Wei Mong Tsang
IPC: H02N2/18
CPC classification number: H02N2/185 , H01L41/1134 , H01L41/1136
Abstract: According to embodiments of the present invention, an energy harvesting device is provided. The energy harvesting device includes a microchannel arranged to receive a fluid, a bluff body arranged to interact with the fluid flowing through the microchannel to generate a vortex fluid street, and an energy harvesting element arranged to interact with the vortex fluid street to harvest energy from the fluid. According to further embodiments of the present invention, a method of harvesting energy is also provided.
Abstract translation: 根据本发明的实施例,提供了一种能量收集装置。 能量收集装置包括布置成接收流体的微通道,布置成与流过微通道的流体相互作用以产生涡流流体街道的非流线体,以及能量收集元件,其布置成与涡流流体街道相互作用以从 流体。 根据本发明的另外的实施例,还提供了一种收获能量的方法。
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