公开(公告)号：US11515237B2

公开(公告)日：2022-11-29

申请号：US17264792

申请日：2019-07-29

Applicant: Agency for Science, Technology and Research

Inventor： Gongyue Tang ,  Kazunori Yamamoto ,  Xiaowu Zhang

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/18 ,  H05K7/20 ,  H01L23/495 ,  H01L23/538 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H01L23/367 ,  H01L23/473

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.

公开(公告)号：US11948861B2

公开(公告)日：2024-04-02

申请号：US17274520

申请日：2019-08-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Gongyue Tang ,  Xiaowu Zhang

IPC: H01L23/473 ,  H01L21/48

CPC classification number: H01L23/4735 ,  H01L21/4871

Abstract: Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.