公开(公告)号：US11101194B2

公开(公告)日：2021-08-24

申请号：US16470961

申请日：2017-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Daniel Minwo Rhee

IPC: H01L23/473 ,  F28F13/06 ,  H05K7/20

Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.

公开(公告)号：US11948861B2

公开(公告)日：2024-04-02

申请号：US17274520

申请日：2019-08-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Gongyue Tang ,  Xiaowu Zhang

IPC: H01L23/473 ,  H01L21/48

CPC classification number: H01L23/4735 ,  H01L21/4871

Abstract: Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.

公开(公告)号：US20200029463A1

公开(公告)日：2020-01-23

申请号：US16470961

申请日：2017-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Daniel Minwo Rhee

IPC: H05K7/20 ,  F28F13/06

Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.