公开(公告)号：US11101194B2

公开(公告)日：2021-08-24

申请号：US16470961

申请日：2017-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Daniel Minwo Rhee

IPC: H01L23/473 ,  F28F13/06 ,  H05K7/20

Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.

公开(公告)号：US11569146B2

公开(公告)日：2023-01-31

申请号：US16312987

申请日：2017-06-08

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Ka Fai Chang ,  Yong Han ,  David Soon Wee Ho ,  Ying Ying Lim

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/42 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/64

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.

公开(公告)号：US11948861B2

公开(公告)日：2024-04-02

申请号：US17274520

申请日：2019-08-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Gongyue Tang ,  Xiaowu Zhang

IPC: H01L23/473 ,  H01L21/48

CPC classification number: H01L23/4735 ,  H01L21/4871

Abstract: Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.

公开(公告)号：US20200029463A1

公开(公告)日：2020-01-23

申请号：US16470961

申请日：2017-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Daniel Minwo Rhee

IPC: H05K7/20 ,  F28F13/06

Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.