Abstract:
A phase corrector for laser trimming a component, the phase corrector comprising: a first correction structure located to a first side of the component, the first correction structure comprising first and second correction regions at first and second distances from the component; and a second correction structure located to a second side the component, the second correction structure comprising third and fourth correction regions at third and fourth distances from the component.
Abstract:
A silicon substrate is provided that may facilitate the formation of RF components more cheaply by using a silicon layer formed by the Czochralski process, and having a carrier life time killing layer deposited on the silicon layer.