公开(公告)号：US20090170209A1

公开(公告)日：2009-07-02

申请号：US11967140

申请日：2007-12-29

Applicant: Andrew Machauf ,  Ariel Cohen ,  IIan Levy

Inventor： Andrew Machauf ,  Ariel Cohen ,  IIan Levy

IPC: G01N31/00

CPC classification number: G01N33/54373

Abstract: An apparatus and method for detecting an analyte wherein a member may respond to mechanical stress induced by a volume change of a sensitive hydrogel upon sensing an analyte and wherein the mechanical stress may be detected by a detector.

Abstract translation: 用于检测分析物的装置和方法，其中成员可以响应感测被分析物时敏感水凝胶的体积变化而引起的机械应力，并且其中机械应力可由检测器检测。

公开(公告)号：US20090241681A1

公开(公告)日：2009-10-01

申请号：US12056771

申请日：2008-03-27

Applicant: Andrew Machauf ,  Ariel Cohen

Inventor： Andrew Machauf ,  Ariel Cohen

IPC: G01B7/16 ,  H01L21/00

CPC classification number: B81B3/0021 ,  B81B2201/0214 ,  G01N27/4145

Abstract: A biosensor using a stress sensor, such as a FET device or a piezoresistive device, embedded in a MEMS structure and coated with hydrogel is provided. The MEMS structure comprises any structure with a flexible portion and may include a cantilever, beam, or plate. When the hydrogel swells due to the presence of an analyte, the hydrogel imparts stress on the MEMS structure which is then detected by the embedded stress sensor. A passivation layer may be included in between the MEMS structure and the hydrogel. The MEMS structure may further be coated with a second hydrogel.

Abstract translation: 提供了使用嵌入在MEMS结构中并涂覆有水凝胶的应力传感器（例如FET器件或压阻器件）的生物传感器。 MEMS结构包括具有柔性部分的任何结构，并且可以包括悬臂梁或板。 当水凝胶由于分析物的存在而膨胀时，水凝胶在MEMS结构上施加应力，然后由嵌入的应力传感器检测。 在MEMS结构和水凝胶之间可以包括钝化层。 MEMS结构还可以用第二水凝胶涂覆。

公开(公告)号：US20070298532A1

公开(公告)日：2007-12-27

申请号：US11476392

申请日：2006-06-27

Applicant: Andrew Machauf

Inventor： Andrew Machauf

IPC: H01L21/00

CPC classification number: B81C1/00333 ,  B81C2201/0115 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/019

Abstract: An apparatus comprising a substrate having therein one or more porous regions, a micro-electro-mechanical (MEMS) device formed on the substrate, a cap formed on the substrate, wherein the cap encapsulates the MEMS device and is formed over at least one of the one or more porous regions, and a sealing layer formed on a back side of the substrate. A process comprising forming one or more porous regions in a substrate, forming a micro-electro-mechanical (MEMS) device on the substrate, forming a sacrificial layer on the substrate over the MEMS device, wherein the sacrificial layer is over at least one of the one or more porous regions, forming a cap on the substrate, wherein the cap encapsulates the MEMS device and the sacrificial layer, etching the sacrificial layer inside the cap by inserting etchant through at least one of the one or more porous regions, and forming a sealing layer on a back side of the substrate.

Abstract translation: 一种包括其中具有一个或多个多孔区域的基板的装置，形成在所述基板上的微机电（MEMS）装置，形成在所述基板上的盖，其中所述盖封装所述MEMS装置，并且形成在所述基板上的至少一个上 所述一个或多个多孔区域和形成在所述基板的背面上的密封层。 一种方法，包括在衬底中形成一个或多个多孔区域，在衬底上形成微电子机械（MEMS）器件，在MEMS器件上在衬底上形成牺牲层，其中牺牲层在 所述一个或多个多孔区域在所述衬底上形成帽，其中所述帽封装所述MEMS器件和所述牺牲层，通过将所述一个或多个多孔区域中的至少一个插入蚀刻剂来蚀刻所述帽内的所述牺牲层，以及形成 在基板的背面上的密封层。