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公开(公告)号：US20240118141A1
公开(公告)日：2024-04-11
申请号：US18391769
申请日：2023-12-21
发明人： Chih-Ming Sun , Ming-Han Tsai
IPC分类号： G01J5/02 , A61B5/00 , A61B5/01 , B81B7/00 , B81B7/02 , G01J5/00 , G01J5/04 , G01J5/14 , G01K13/20 , H04N23/56
CPC分类号： G01J5/0265 , A61B5/01 , A61B5/681 , B81B7/0025 , B81B7/0061 , B81B7/02 , G01J5/0025 , G01J5/027 , G01J5/04 , G01J5/046 , G01J5/14 , G01K13/20 , H04N23/56 , A61B5/02416 , B81B2201/0214 , B81B2201/0235 , B81B2201/0242 , B81B2201/0278 , H01L2224/48091 , H01L2924/16151 , H01L2924/16153 , H01L2924/16235
摘要： The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.
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公开(公告)号：US11926521B2
公开(公告)日：2024-03-12
申请号：US17150527
申请日：2021-01-15
CPC分类号： B81B7/0067 , B81C1/00317 , G01N29/2418 , G01N33/0027 , B81B2201/0214 , B81B2203/0127 , B81B2207/095
摘要： An infrared emitter with a glass lid for emitting infrared radiation comprises a package enclosing a cavity, wherein a first part is transparent for infrared radiation and a second part comprises a glass material and a heating structure configured for emitting the infrared radiation, wherein the heating structure is arranged in the cavity between the first part and the second part of the package.
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公开(公告)号：US20230242394A1
公开(公告)日：2023-08-03
申请号：US18004527
申请日：2021-07-01
发明人： Achim Bittner , Alfons Dehé
CPC分类号： B81C1/00309 , B81B7/0061 , B81C2203/0136 , B81C2203/0707 , B81B2201/0257 , B81B2201/047 , B81B2201/0214 , B81B2201/0271 , B81B2207/012 , B81B2207/015 , B81B2203/0127 , B81B2207/07
摘要： Preferably, the invention relates to a MEMS package having at least one layer for protecting a MEMS element, wherein the MEMS element has at least one MEMS interaction region on a substrate and a surface conformal coating of the MEMS element is applied with a dielectric layer. Particularly preferably, the invention relates to a MEMS transducer package in which a MEMS element, for example with a MEMS membrane and processor, preferably an integrated circuit, are present on a substrate. For protection, a surface conformal coating of a dielectric is preferably first applied to the MEMS element, for example by spray coating, mist coating, and/or vapor coating. Then, preferably, an electrically conductive layer is applied. Depending on the configuration, the layers may be removed in some regions above a MEMS interaction region of the MEMS element, for example for a sound port of a MEMS membrane.
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4.发明申请公开(公告)号：US20190152772A1
公开(公告)日：2019-05-23
申请号：US16091384
申请日：2017-04-06
CPC分类号： B81C1/00158 , B81B3/0021 , B81B2201/0214 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00047 , B81C1/00476 , B81C2201/0116
摘要： A process for fabricating a micromechanical structure made of silicon carbide including a cavity, from a stack including a first silicon-carbide layer and a silicon layer on the first silicon-carbide layer, the process including shaping the silicon layer so as to form a discrete silicon structure on the first silicon-carbide layer. The process further includes, after the shaping of the silicon layer, a carbonization to initiate the removal of the discrete silicon structure; depositing a second silicon-carbide layer; and an annealing step, the discrete silicon structure being entirely removed at the end of the annealing.
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公开(公告)号：US20180235521A1
公开(公告)日：2018-08-23
申请号：US15958725
申请日：2018-04-20
发明人： Jason Heikenfeld
CPC分类号： A61B5/14517 , A61B5/01 , A61B5/053 , A61B5/6801 , A61B10/0064 , B01L3/502707 , B01L3/502715 , B01L3/50273 , B01L2300/0627 , B01L2300/0636 , B01L2300/0645 , B01L2300/0663 , B01L2300/0816 , B01L2300/0864 , B01L2300/126 , B01L2300/161 , B01L2300/168 , B01L2400/04 , B01L2400/0406 , B81B7/0006 , B81B2201/0214 , B81B2201/05 , B81B2201/058 , B81B2203/033 , B81B2203/0338 , B81C1/00206
摘要： The disclosed invention provides a biofluid collection device configured with a hexagonal open microfluidic network, which facilitates nanoliter-scale biofluid collection and transport for biosensing applications. In one embodiment, a biofluid sensing device placed on the skin for measuring a characteristic of an analyte in sweat includes one or more biofluid sensors and a hexagonal open microfluidic network biofluid collector. The disclosed collector provides a volume-reduced pathway for sweat biofluid between the one or more sensors and sweat glands when the device is positioned on the skin. In another embodiment, a biofluid collector includes a network of microchannels comprising three or more repeatedly intersecting channels that provide redundant pathways for biofluid transport.
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公开(公告)号：US20180215611A1
公开(公告)日：2018-08-02
申请号：US15937398
申请日：2018-03-27
申请人： VAON, LLC
发明人： Henry Steen , Alexander Larin , Jon Paschal , Quentin Lineberry , Keith Andrew , Phillip Womble
CPC分类号： B81B7/0058 , B32B3/266 , B32B17/06 , B32B2457/00 , B81B3/0081 , B81B5/00 , B81B2201/0214 , B81B2203/056 , B81B2203/06 , B81C1/00182 , B81C2201/019
摘要： The present invention generally relates to multi-layer glass structures and methods of making the same.
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7.发明申请公开(公告)号：US20180194617A1
公开(公告)日：2018-07-12
申请号：US15864070
申请日：2018-01-08
申请人： Robert Bosch GmbH
发明人： Andreas Krauss , Elisabeth Preiss
CPC分类号： B81C1/00158 , B81B3/0081 , B81B2201/0214 , G01N27/128 , G01N27/14 , G01N33/0009 , G01N33/0013
摘要： A micromechanical sensor device and a corresponding manufacturing method. The micromechanical sensor device is equipped with a substrate which includes a diaphragm area, multiple sensor layer areas being formed on the diaphragm area, which have a particular structured sensor layer; and a particular electrode device, via which the sensor layer areas are electrically connectable outside of the diaphragm area, the sensor layer areas being structured in such a way that they have length and width dimensions of a magnitude between 1 and 10 micrometers.
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公开(公告)号：US20180164432A1
公开(公告)日：2018-06-14
申请号：US15880261
申请日：2018-01-25
申请人： Cornell University
发明人： Amit Lal , Serhan Ardanuc , Jason T. Hoople , Justin C. Kuo
CPC分类号： G06N3/04 , B81B3/0021 , B81B2201/018 , B81B2201/0214 , B81B2201/0285 , B81B2203/04 , G01S7/52079 , G01S7/521 , G01S15/02 , G01S15/8925 , G06K9/0002 , G06N3/0635 , H01H1/0094 , H01J49/025
摘要： Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.
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公开(公告)号：US09796580B2
公开(公告)日：2017-10-24
申请号：US14738745
申请日：2015-06-12
申请人： InvenSense, Inc.
发明人： Peter Smeys , Martin Lim
IPC分类号： B81B7/00
CPC分类号： B81B7/007 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/0278 , B81B2203/0315 , B81B2207/012 , B81C1/00238 , B81C2203/0785 , B81C2203/0792 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/00012
摘要： A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate. The second surface of the MEMS substrate is attached to the second substrate. The first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical inter-connects.
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公开(公告)号：US09714443B2
公开(公告)日：2017-07-25
申请号：US13679328
申请日：2012-11-16
CPC分类号： C12Q1/28 , B01L3/5025 , B01L3/50273 , B01L3/502738 , B01L2300/0861 , B01L2300/0887 , B01L2400/0481 , B01L2400/0655 , B81B2201/0214 , B81B2201/054 , B81B2201/07 , B81C1/00119 , F15C5/00 , F16K11/20 , F16K99/0001 , F16K99/0015 , F16K99/0059 , F16K2099/0074 , F16K2099/0076 , F16K2099/0078 , F16K2099/008 , F16K2099/0084 , F16K2099/0094 , Y10T137/0318 , Y10T137/0329 , Y10T137/2224 , Y10T137/85938 , Y10T137/87249
摘要： High-density microfluidic chips contain plumbing networks with thousands of micromechanical valves and hundreds of individually addressable chambers. These fluidic devices are analogous to electronic integrated circuits fabricated using large scale integration (LSI). A component of these networks is the fluidic multiplexor, which is a combinatorial array of binary valve patterns that exponentially increases the processing power of a network by allowing complex fluid manipulations with a minimal number of inputs. These integrated microfluidic networks can be used to construct a variety of highly complex microfluidic devices, for example the microfluidic analog of a comparator array, and a microfluidic memory storage device resembling electronic random access memories.
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