公开(公告)号：US12114453B2

公开(公告)日：2024-10-08

申请号：US16449061

申请日：2019-06-21

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  A45C11/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  A45C11/00 ,  G06F1/1626 ,  H04M1/0283 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03 ,  A45C2011/002 ,  G06F2200/1633

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20240284624A1

公开(公告)日：2024-08-22

申请号：US18650720

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  A45C11/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  A45C11/00 ,  G06F1/1626 ,  H04M1/0283 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03 ,  A45C2011/002 ,  G06F2200/1633

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20200245487A1

公开(公告)日：2020-07-30

申请号：US16449061

申请日：2019-06-21

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  H04M1/02 ,  G06F1/16 ,  A45C11/00 ,  H05K5/03 ,  H05K5/00 ,  H05K5/02

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.