Wafer-Level Laser Assemblies Having Extended Resonant Cavities

    公开(公告)号:US20240372324A1

    公开(公告)日:2024-11-07

    申请号:US18143517

    申请日:2023-05-04

    Applicant: Apple Inc.

    Abstract: A laser assembly includes a set of one or more substrates having a first surface opposite a second surface. The set of one or more substrates defines a resonant cavity extension. The resonant cavity extension extends into the set of one or more substrates from an opening in the first surface. The laser assembly further includes a first reflector disposed within the resonant cavity extension and configured to reflect at least one wavelength of electromagnetic radiation received through the opening back through the opening; a laser having an active region configured to generate the at least one wavelength of electromagnetic radiation; and a second reflector. The active region is disposed in a resonant cavity extending between the first reflector and the second reflector. The resonant cavity includes the resonant cavity extension.

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