公开(公告)号：US20240267447A1

公开(公告)日：2024-08-08

申请号：US18243531

申请日：2023-09-07

Applicant: Apple Inc.

Inventor： Laura M. Burke ,  Woonyong Bae ,  Joel Ravi ,  Daniel W. Jarvis ,  Jason P. Shannon ,  Marwan Rammah ,  Alexander K. Mark ,  Maxwell Zhang ,  Ekaterina Pease ,  Sara Salmon ,  Ethan Stobbe

IPC: H04M1/02

CPC classification number: H04M1/026

Abstract: A mobile phone may include a connector module configured to couple to a charging cable, antenna circuitry conductively coupled to a first housing component and a second housing component, and a processing system configured to, in accordance with a determination that the connector module is decoupled from the charging cable, cause the second housing component to operate as a first radiating element for the antenna circuitry, and in accordance with a determination that the connector module is coupled to the charging cable and that an operational condition of the connector module is satisfied, cause the first housing component to operate as at least a portion of a second radiating element for the antenna circuitry.

公开(公告)号：US20250087869A1

公开(公告)日：2025-03-13

申请号：US18465014

申请日：2023-09-11

Applicant: Apple Inc.

Inventor： Ming Chen ,  Enrique Ayala Vazquez ,  Joel Ravi ,  Woonyong Bae ,  Laura M Burke ,  Yuancheng Xu ,  Bhaskara R Rupakula ,  Haozhan Tian ,  Salih Yarga ,  Erdinc Irci ,  Tiejun Yu ,  Seyed Mohammad Amjadi ,  Ahmed Ali Abdelhaliem Nafe ,  Hongfei Hu ,  Carlo Di Nallo ,  Mattia Pascolini

IPC: H01Q1/24 ,  H05K5/02

Abstract: An electronic device may be provided with sidewalls and a conductive plate. A segment of the sidewalls may form a radiating arm of an antenna. A display may be mounted to the sidewalls. The display may include a conductive frame and a flexible printed circuit. The flexible circuit may have a bend. Conductive foam may short a conductive trace on the flexible circuit to the conductive frame near the bend. Low injection pressure overmolding (LIPO) may be molded over the flexible circuit, the foam, and the frame. A conductive spring may short the frame to the conductive plate. The spring may include a wider and/or thinner portion that optionally includes one or more notches for reducing its inductance. The conductive plate, the spring, the frame, the foam, and the conductive trace may form part of the antenna ground for the antenna.

公开(公告)号：US20250087868A1

公开(公告)日：2025-03-13

申请号：US18464969

申请日：2023-09-11

Applicant: Apple Inc.

Inventor： Alden T Rush ,  Salih Yarga ,  Joel Ravi ,  Woonyong Bae ,  Laura M Burke ,  Bhaskara R Rupakula ,  Haozhan Tian ,  Erdinc Irci ,  Hongfei Hu ,  Carlo Di Nallo

IPC: H01Q1/24 ,  H01Q3/36 ,  H01Q5/25

Abstract: An electronic device may be provided with a housing having sidewalls, a dielectric cover, and a conductive plate. A display may be mounted to the sidewalls opposite the dielectric cover. A logic board may be interposed between the display and the plate. The device may include a phased antenna array on a first module and an ultra-wideband (UWB) on a second module. The first and second modules may be surface-mounted to the main body of a flexible printed circuit between the plate and the dielectric cover. The UWB antenna and the array may convey radio-frequency signals through the dielectric cover. The flexible printed circuit may have a tail that carries the transmission lines for the UWB antenna and the array. The tail may be folded through a hole in the mid-chassis and coupled to a radio-frequency connector on the logic board.