公开(公告)号：US20250087869A1

公开(公告)日：2025-03-13

申请号：US18465014

申请日：2023-09-11

Applicant: Apple Inc.

Inventor： Ming Chen ,  Enrique Ayala Vazquez ,  Joel Ravi ,  Woonyong Bae ,  Laura M Burke ,  Yuancheng Xu ,  Bhaskara R Rupakula ,  Haozhan Tian ,  Salih Yarga ,  Erdinc Irci ,  Tiejun Yu ,  Seyed Mohammad Amjadi ,  Ahmed Ali Abdelhaliem Nafe ,  Hongfei Hu ,  Carlo Di Nallo ,  Mattia Pascolini

IPC: H01Q1/24 ,  H05K5/02

Abstract: An electronic device may be provided with sidewalls and a conductive plate. A segment of the sidewalls may form a radiating arm of an antenna. A display may be mounted to the sidewalls. The display may include a conductive frame and a flexible printed circuit. The flexible circuit may have a bend. Conductive foam may short a conductive trace on the flexible circuit to the conductive frame near the bend. Low injection pressure overmolding (LIPO) may be molded over the flexible circuit, the foam, and the frame. A conductive spring may short the frame to the conductive plate. The spring may include a wider and/or thinner portion that optionally includes one or more notches for reducing its inductance. The conductive plate, the spring, the frame, the foam, and the conductive trace may form part of the antenna ground for the antenna.

公开(公告)号：US20250087868A1

公开(公告)日：2025-03-13

申请号：US18464969

申请日：2023-09-11

Applicant: Apple Inc.

Inventor： Alden T Rush ,  Salih Yarga ,  Joel Ravi ,  Woonyong Bae ,  Laura M Burke ,  Bhaskara R Rupakula ,  Haozhan Tian ,  Erdinc Irci ,  Hongfei Hu ,  Carlo Di Nallo

IPC: H01Q1/24 ,  H01Q3/36 ,  H01Q5/25

Abstract: An electronic device may be provided with a housing having sidewalls, a dielectric cover, and a conductive plate. A display may be mounted to the sidewalls opposite the dielectric cover. A logic board may be interposed between the display and the plate. The device may include a phased antenna array on a first module and an ultra-wideband (UWB) on a second module. The first and second modules may be surface-mounted to the main body of a flexible printed circuit between the plate and the dielectric cover. The UWB antenna and the array may convey radio-frequency signals through the dielectric cover. The flexible printed circuit may have a tail that carries the transmission lines for the UWB antenna and the array. The tail may be folded through a hole in the mid-chassis and coupled to a radio-frequency connector on the logic board.