公开(公告)号：US20240107249A1

公开(公告)日：2024-03-28

申请号：US18119600

申请日：2023-03-09

Applicant: Apple Inc.

Inventor： Kyusang KIM ,  Ali N. Ergun ,  Anthony D. Minervini ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan

IPC: H04R31/00 ,  H04R1/04

CPC classification number: H04R31/00 ,  H04R1/04

Abstract: Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.